PCB英文ICS总结重新整理修订

第一篇：PCB英文ICS总结重新整理修订

英文ICS总结

1． Thickness，Line（1）没有明确指出铜厚

Question description：The copper for all layer is not indicated, we can‘t make sure how to build.GF Suggestion：We will use 1oz copper thickness for inner layer, for outer layer, we will use H oz as base copper thickness and plate to 1oz finished copper thickness.Question description The copper thickness is not indicated.GF Suggestion： We will use 1OZ copper foil on inner layers, and use H oz as base copper then plated to 1 oz.Please kindly confirm!

（2）1OZ建议为完成铜厚

Question description：In Gerber file copper thickness request 1OZ,but we can‘t make sure this copper thickness is finished copper thickness.GF Suggestion：We will 1OZ copper finished thickness, Please confirm kindly.（3）建议1.6MM做完成板厚

Question description: You request board thickness 1.60mm, we can＇t make sure if it is finished board thickness and bare board thickness。

GF Suggestion：1.We will control the finished board thickness as 1.6+/-10%mm 2.We will control the finished board thickness(including plating copper thickness and solder mask thickness)as 1.60+/-0.16mm。

Question description：We don‘t know the 1.6MM is finished board thickness or laminate board thickness.GF Suggestion：1.Regard 1.6MM as the finished board thickness(including the plating copper thickness, solder mask and silkscreen thickness).2.Regard 1.6MM as the laminate board thickness(no including the plating copper thickness, solder mask and silkscreen thickness).（4）1OZ建议做到1.70OZ Question description：You required 2OZ finished copper thickness as but it is。

GF Suggestion：Please relax the finished copper thickness to 1.7/1.7oz(min)，difficult for us to plate the copper from 1/1oz to 2/2oz。

（5）PTL的厚度和资料中要求的板厚不同

Question description：The board thickness that you supplied 0.059inch in PO is unmatched that in drawing file ―sheet 1 of 1‖ 0.063inch.GF Suggestion：We will control the finished board thickness as 1.6+/-10%mm。（6）无完成板厚要求

Question description：No call finished board thickness.GF Suggestion： Finished board thickness 1.6+/-10% mm.（6）调整层压板厚结构

Question description：Customer has asked to change the final board thickness from 47mil to 62mil, and the impedance is also required in the lay-up details, in order to control the 6mil line with impedance as 62+/-10%ohms.We would have to adjust the lay-up structure slightly as shown.(See the fig02.jpg)GF Suggestion: Please confirm.。

（7）内层底铜不确定

Question description：The copper thickness on inner layers was not indicated.GF Suggestion：2 OZ copper clad on inner layers.Please confirm!

（8）锡厚8—12um，建议最小1um Question description： On drill drawing, it defined the Tin-Lead thickness as 8-12um，it is too difficult to control during mass production.GF Suggestion： We suggest control the Tin-Lead thickness as 1um(min).（9）厚度不明确

Question description：We don‘t know the 1.57mm is laminate thickness or total board thickness(including the plated thickness, solder mask and silkscreen thickness).GF Suggestion：We will regard the 1.57mm as total board thickness(including the plated thickness, solder mask and silkscreen thickness), please kindly confirm!

（10）镀金厚度

Question description： Customer required, ―SHALL BE AU PLATED, 5UIN.MIN.”，it is over our technical ability(4uin.Max.)GF Suggestion：We will follow our technical ability to control the Au plated, 2uin.min, please kindly confirm!（11）控制锡厚度

Question description：HASL thickness 5~15um is difficult to control for us.GF Suggestion：Pls.relax it to 1um(min.)（14）锡厚控制

Question description：Tin thickness is required as 0.3mil,but this is too thick and has extended out of our capability.GF Suggestion：Control the solder thickness as 0.04mil min.（15）外层铜厚度

Question description：Customer required that copper outer was 0.5oz finished, but it‘s difficult for us to build as 0.5oz finished copper for outer layers.GF Suggestion： We would like to use 0.5oz base copper plated to 35um(min)for outer layers.（16）层压厚度调整

Question description：Customer required that ―core layer spacing GND-PWR was 0.8mm(min), and prepreg layer spacing TOP-GND, PWR-BOT was 0.3mm(min)‖, but in order to reduce the cost。

GF Suggestion：We would like to adjust the core layer spacing GND-PWR to 0.63mm and prepreg layer spacing TOP-GND, PWR-BOT to 0.38mm.（17）锡厚

Question description： Customer required that ―ALL COPPER PADS AND PLATED THROUGH HOLES SHALL BE SOLDER DIPPED AND HOT AIR LEVELED WITH 63/37 TIN LEAD TO A THICKNESS OF.001 TO.0014 INCHES.‖ in NO.8 But the thickness of tin-lead on copper pads was too thick for us to control.GF Suggestion： We would like to control the thickness of tin-lead as 0.0001 inches(min)on holes wall and 0.00004 inches(min)on copper pads.(18)沉金厚度

Question description： Customer required that immersion gold thickness was 1u‖ to 3u‖, but it‘s too tight for us to control.GF Suggestion： Please relax it to 1u‖ to 6u‖.（19）镀金厚度

Question description：Customer required, ―SHALL BE AU PLATED, 5UIN.MIN.”，it is over our technical ability(4uin.Max.)GF Suggestion：We will follow our technical ability to control the Au plated, 2uin.min, please kindly confirm!（20）V-CUT余厚太厚，不好分板

Question description: In Gerber file ,you request V-CUT residual thickness 0.025+/-0.004,it is difficult for you to separate the board，see fig below.GF Suggestion：We will control the V-CUT angle as 30+/-5 degree, and the remaining thickness 0.020+/-0.004‖, please confirm kindly（21）板厚公差超出我们能力

Question description: the finished board thickness tolerance ‖+/-0.003inch‖ is out of our capability.(See fig01.jpg)GF Suggestion: Please relax to +/-0.006inch.（22）板厚度公差太大

Question description: The finished board thickness tolerance 62mil+/-5mil is too tight for us to control GF Suggestion：Relax the board thickness tolerance to 62+/-7mil.（23）线路与PAD之间没有连接上 断线头

Question description：There are snap circuit in the board, we can‘t make sure if it is normal design.See fig below.GF Suggestion： We will think it is normal design and follow Gerber to build.（24）铜皮的边缘有锐齿

Question description：The are some saw tooth copper，we can‘t make sure if it is normal design.See fig2.pdf

GF Suggestion：

1、We will follow Gerber file to build，Please kindly confirm!

2、We will shave the saw tooth copper to keep the copper smooth

（25）间隙太小，建议填实

Question description：There are some gap in the big copper, we can‘t make sure if we need to infill these gap.GF Suggestion：We will infill these gap with copper, please confirm kindly.Question description：The clearance between the copper grids on topside is only 0.001‖(see fig04);it cannot be etched out during our process.GF Suggestion： We suggest filling them as wholly copper.（26）隔离环形状的改变

Question description：See fig below, some slot is unmatched with its thermal pad in inner layer.GF Suggestion： We will coordinate the thermal pad according to the slot shape, please confirm kindly.（27）开短路

Question description：See fig below, there are 0.00013mm gap between the circuit and pad, we can‘t make sure if it be short or open.GF Suggestion：

1、If it should be open, we will move the circuit away the pads to avoid the short happened.2、If it should be short, we will fill the gap between the circuit and the pad with copper, please confirm kindly.（28）线路离边太近。刮铜，移动线路，同时进行

Question description：The copper is close to the board edge that will lead to copper exposed after milling and beveling.(See fig03)GF Suggestion： Shave copper or move conductor and avoid copper to be exposed.（29）断线处理

Question description：There are snap circuit in the board, we can‘t make sure if it is normal design.See fig below.GF Suggestion： We will think it is normal design and follow Gerber to build.（30）移线

Question description：On top side, there are one trace which is overlap the outline, when profile outline, it will damage this trace see fig below GF Suggestion：We suggest shifting this trace into the board so as to keep enough spacing between the outline and the trace.2.Hole（1）没有定义孔的属性

Question description：No define the attribute of all holes and four DIA 125mil is located at tab isolate position.GF Suggestion：Make these four holes to NPTH and others PTH。Question description：The hole attribute is undefined(PTH or NPTH)。

GF Suggestion：So we will build these holes without pad as NPTH, the rest are PTH, please confirm kindly.（2）孔大于PAD，两面均为独立的，资料定义为PTH Question description：Two Dia.100mil hole is as big as its pad, and they are isolated on both sides, but you defined it as PTH.See fig below.GF Suggestion：

1、We will build this hole as NPTH.2、We will build this as PTH without ring.（3）孔与PAD等大，两面均为独立的，资料定义为PTH Question description：You defined two DIA。100mil as PTH holes, but these two holes have as large as its PAD，and isolated on both sides, see fig below.GF Suggestion：A、Build these two holes as PTH holes without ring。B、Build these two holes as NPTH holes, please confirm kindly.（4）孔离边太近，建议客户接受破孔

Question description：In Gerber file Two φ50mil的NPTH holes are closed to board edge, See fig below, after fabrication.Them will cause these two holes to be broken.GF Suggestion:

1、Follow the Gerber file to build, and broken holes is allowed.2、We will move these holes inside the board, avoid these holes broken holes.Question description：Some slot is so closed to the board edge that it will slot broken.GF Suggestion：We will follow Gerber to build, it is allowed slot broken.（5）孔或PAD距V-CUT太近，建议接受破孔,露铜

Question description：Some holes and pads are so closed to the V-cut centre that copper will be exposed and these holes maybe broken, see fig below.GF Suggestion： We will follow Gerber to build, copper exposed and hole broken is allowed.Question description： In Gerber file, the finger is too closed to the board edge, after routing, copper will be exposed at the slot edge.See fig below.GF Suggestion： We will follow Gerber to build, Copper exposed is allowed.Question description：See the figure below, some circuit is so closed to the outline(just 0.12mm)that it will cause circuit damaged after v-cut.GF Suggestion： We will move these circuits inside the board to avoid circuit to be V-cut.（6）不确定某些层的孔圈是否需要做出

Question description：We can‘t make sure if we need to build these holes that you marked in layer ―board outline‖

GF Suggestion：We will build these holes as NPTH, please confirm kindly.（7）NPTH孔钻于大铜面上或PAD上

Question description：Some NPTH holes are drilled on big copper, see fig below.GF Suggestion：We will shave copper or pad to get 10mil clearance around the NPTH to avoid copper exposed at the hole edge.（8）NPTH孔距离内层线路太近

Question description：Some NPTH is so closed to the circuit(just 4mil)in inner layer that it will cause circuit damaged.GF Suggestion：We will move these circuits away from the NPTH to avoid circuit damaged.（9）建议过孔绿油入孔但不塞孔制作

Question description:In Gerber file, all ofφ0.3mm holes have no solder mask openings on both sides.GF Suggestion: Allow solder mask into holes but don‘t plug them.Question description：No S/M opening for DIA.0.3mm holes.GF Suggestion：We will build these holes as solder mask in holes but not plug them, please confirm kindly.Question description：No S/M opening for some DIA.0.25mm, 0.30mm holes.GF Suggestion：We will plug these VIAS with solder mask, please confirm kindly.（10）部分孔径较大，塞孔超出我司能力

Question description：If question 1 you accept suggestion, No S/M opening for Dia.0.60mm holes on both sides, but these hole too big to plug, It is out of our capability to fabricate.GF Suggestion：We will build these holes as solder mask in holes but not plug them, please confirm kindly.（11）资料中的孔数为44个，但孔表中只有42个，而文件中有孔位

Question description：The quantity of DIA： 28mil is 44 in drill symbol table, but the quantity of DIA： 28mil is 42 in drill tape(see figure 1,these two positions have no hole, only have drill symbol), them is conflicting.GF Suggestion：Following to drill symbol table(the quantity of DIA: 28mil is 44)to drill these two hole.（12）文件中的孔数与孔表中的孔不相符

Question description：You mention that there are 286 DIAS 32mil holes in drill drawing(see fig below), but we only found 283 DIAS.32mil holes in drill tape.GF Suggestion：We will follow the drill tape to build, please confirm kindly.Question description：In drill tape, the hole size corresponding to the symbol ―U‖ is dia30.1mil, but the hole chart define the ―U‖ hole size as 20x50mil, at the same time, the drawing require the ―U‖ hole size as 30x50mil, see fig01.GF Suggestion：1.Build the ―U‖ holes size as 24x50mil.2.Build the ―U‖ holes size as 30x50mil.Question description：Some thermal pad size is smaller than hole size on inner layers, see fig02.GF Suggestion： Delete these thermal pads, which are smaller than hole size.（13）由孔改变成SLOT Question description：Some DIA.3.94mil holes should be changed to slot, but we can't make sure the attribute of these slot.GF Suggestion：We will build the size 2mmX4mm slot as NPTH, and build the size 1.5X3.25mm slot as PTH, also the holes centre is the slot centre, please confirm kindly.See fig below.（14）无焊盘的孔

Question description：Slots of 3.3*5.0 mm are stated as PTH slots, but two slots have no pads on both sides，see picture below.GF Suggestion:

1.Build these two slots, as PTH slots but have no ring on both sides.2.Build them as NPTH slots.Question description：There were 4X φ3.50mm holes defined as PTH holes in the file ―MCUV.drl‖, but them located on copper on one side without copper pad on the other side, see fig below.GF Suggestion：

1、We will build the fourφ3.50mm holes located on copper on one side as PTH and other as NPTH, and build the four holes without annular ring on no pad side.2、We will build all of the φ3.50mm holes as NPTH, and shave copper for 10mil to get enough spacing for tenting holes in our process.（15）板中无工具孔，建议增加三个工具孔在板上

Question description：No suitable tooling hole for routing and E-test process on board.GF Suggestion：In order to help to fabricate, we suggest to add three 2.0mm NPTH on board, approximately location shown as fig04

Question description：There are no NPTH holes for tooling holes in this board，it will bring us some difficulties in routing and E-test process.GF Suggestion： So we will add three DIA。3.0mm NPTH for tooling holes, please confirm kindly.（16）使用PTH孔做工具孔，允许孔壁擦花

Question description：There are not proper NPTH holes as tooling hole in the board, If above is confirm, We need 3X Dia.2.0mm~5.0mm holes to build as guided holes for E-TEST and routing process, but we have only 2X NPTH holes, So we will use 1X Dia.125mil PTH hole as guided holes and the slightly scrape for the PTH hole is accepted, see picture below.GF Suggestion：Please kindly confirm.（17）孔间距太近，建议客户做SLOT槽

Question description：In Gerber file six φ37mil PTH holes ,they are so close with each, we can‘t make sure if we need to build them as a slot.See fig1.GF Suggestion: We will build them as slot, the slot size is 0.94mmX2.59mm, please confirm kindly（18）板中没有工具孔，而PTH孔都太小，增加三个工具孔将削铜10MIL Question description： No tooling holes for this board(There are no NPTH holes exist in this board, and all PTH hole are too small).We will add three holes for tooling according to attached file 4008221A0 pdf.But these holes are drilled on bigger copper in out layer and inner layer，we will shave copper to get 10 mil clearance around it for avoiding copper exposed.GF Suggestion ： Please confirm kindly.（19）孔大于PAD，允许崩盘

Question description：In Gerber file ,part φ47mil holes art defined as PTH holes, but have 3 holes on both sides PADS is smaller than its pads ,see fig below.GF Suggestion：We will follow Gerber to build, broken pad is allowed.（20）孔间隙太小，建议缩小孔径

Question description：We found the distance between two stamp holes is so close(only 0.13mm), it may cause holes broken after drilled.GF Suggestion：We will reduce the size of the stamp holes from 0.508mm to 0.40mm and avoid hole broken.（21）管位孔，孔壁允许轻微摩擦

Question description: Due to no non-plated hole in board, we will choose three plats hole in board to assist manufacturing and slight scrape in holes maybe occur.GF Suggestion：Please kindly confirm it is acceptable.（22）非沉铜孔，周围有PAD，二钻,允许孔边露铜

Question description: There are four DIA 142mil and one DIA 125mil holes drilled on the copper pad of the top or bottom side circuit layer.(See fig04.jpg)GF Suggestion： Second drill the NPTH hole and the copper pad around the hole exposed is acceptable.Please confirm.（23）无孔的属性

Question description：No call the holes type(PTH or NPTH)(see fig01)GF Suggestion： Holes 0.11‖(12x)are NPTH, others are PTH, please kindly confirm!（24）过电孔无开窗，按绿油入孔但不塞孔制作

Question description：All the VIA holes(DIA 0.4mm and 0.5mm)have no solder mask openings on the both sides.We would build them, as Solder Mask can be into holes but not plug them.GF Suggestion： Please confirm.（25）孔上PAD，同时孔上线路，孔不合理，删除孔

Question description：The holes(DIA.30mil, GF Suggestion：We suggest remove all these holes(dia.30mil, count: 96)which all drilled on SMT PAD on TOP side, and on BOTTOM side partly of these holes drilled on traces(see fig01), we think this design is abnormal.After our incoming checking, we regard these holes(dia.30mil, count: 96)are redundant.GF Suggestion：1.We suggest removes all these holes(dia.30mil, count: 96).2.Otherwise please customer to resend drill data to us so that we can precede this board efficiently.（26）孔与PAD等大，删除PAD，做NPTH Question description： On current drill data, some holes(dia.118mil, 4x: dia.135mil, 4x;dia.135mil, 16x;dia.138mil, 12x)are required as PTH on file Loop Card-P.DRR(see fig02)，but on GERBER file their pads size are equal to the finished hole and their pad are isolated on both sides.GF Suggestion： We suggest drill these above mentioned holes as Non-plated holes(SEE FIG03).（27）无重孔，客户胡说八道

Question description： On file Loop Card-P.DRR(see fig02), it state:‖ Two holes at same point: 40 ‖，but in fact ,we didn‘t find any two hole at same point.GF Suggestion：We suggest ignore this statement.（28）NPTH在大铜面上，刮铜离边10mil Question description：There are 3 holes(NPTH, DIA.30mil)per unit, which drilled on big copper on topsides, and have pad with size dia.79mil on bottom side(see fig04).GF Suggestion： We will shave copper to get 10mil clearance away from hole edge on both sides.（29）孔钻到了线路上，二钻这两个孔，允许露铜

Question description: there are two DIA 3.0mm NPTH holes drilled over the circuit pad partly on both sides.(See fig02.jpg)GF Suggestion： Second drill the two-NPTH hole and the copper pad around the hole wall exposed is acceptable.Please confirm!（30）孔一面开了等大的窗，一面无开窗

Question description： In artwork five DIA 130 mil holes have no solder mask opening on topside and the solder mask opening is the same size with drill hole on bottom side.Please see fig 1 question 3.GF Suggestion： 1.We will enlarge or add the solder mask opening to match the pads both sides.2.Cover pads on both side and to avoid ink into holes we will leave a little annular ring around the hole.3.Cover pads on top side and to avoid ink into holes we will leave a little annular ring around the hole, increase the solder mask opening to match the pads on bottom side.4.Please give other advice.（31）孔，单面无开窗。1.加阻焊窗。2.盖焊环有锡圈

Question description： In artwork sixteen DIA 41 mil holes have no solder mask opening on topside。

GF Suggestion：1.Cover pads on topside and to avoid ink into holes we will leave a little annular ring around the hole.2.Add solder mask opening on topside to match the square pads.3.Please give other advice.（32）无孔的属性。全部按PTH做

Question description： In artwork there is no information for hole attribute.GF Suggestion： We will make all holes as plated thru holes Please confirm.（33）PTH孔，无PAD。1,做NPTH。2,做无PAD的PTH Question description： It stated in drill drawing that the DIA 3.0mm holes are plated holes but have no pads in Gerber.Please see fig 1 question 1 GF Suggestion：1.Make these two holes as non-plated holes.2.Make them as plated holes without annular ring both sides.（34）无孔的属性，其中有一个孔没有PAD，做NPTH Question description： There is no information for the holes attribute in artwork and the DIA 3.5mm holes have no pads for the original design please see fig 1 question 3.GF Suggestion： 1.Make them as non-plated holes.2.Make them as plated holes without annular ring both sides.3.Please give other advice.（35）PTH孔做管位孔，允许孔壁轻微擦花

Question description： There are no NPTH holes as tooling holes for the routing and E-test process.GF Suggestion： We suggest to use PTH hole as the tooling holes, and then these holes wall will be slightly scrap and copper exposed allowable.（36）过电孔双面未开窗，按绿油入孔但不塞孔制作

Question description： No solder mask opening for DIA.0.7mm via hole on both sides

GF Suggestion： Follow CAD to build, the solder mask fall into hole but not plug.（37）孔太大，不宜钻，建议铣并放宽公差

Question description：The 6.3mm NPT hole is too big to drill.GF Suggestion：Fabricate the hole by routing and relax its tolerance to +/-0.13mm.（38）孔和PAD偏位

Question description：Pad and via hole shown in picture below is deviated from the desired location.GF Suggestion： 1：Adjust the location of pad according to its solder mask opening, and move via hole to center of pad.2：Follow Gerber to build but enlarge the solder mask opening.（39）叠孔处理

Question description：Hole legend of dia.28mil and dia.40mil is at the same position, see picture below, and there are 561 of dia.28mil holes, but the quantity of dia.28mil holes in tape is 560.GF Suggestion：Follow drill tape to build.（40）没有孔做工具孔，允许使用PTH孔，允许檫花

Question description： There are no NPTH holes to be used as guiding holes for E-Test and routing.GF Suggestion：Use PTH hole as guiding hole, and scratching hole wall a little is acceptable.（41）孔铜厚度更改

Question description：Copper thickness on hole wall is required as 1.5mil,this is too thick for us to plat.GF Suggestion：We will control the minimum hole wall thickness as 1mil.（42）没有PAD的孔

Question description：No pad for four DIA.118mil holes, and one pad of DIA.67mil holes are smaller than its hole.But you defined these holes as PTH.GF Suggestion：

1、We will build them as PTH without ring.2、We will build these holes as NPTH，please confirm kindly.（43）孔公差

Question description: Like fig below, you defined this PTH holes tolerance as +3mil/-0, it is difficult for us to meet you requirement.GF Suggestion：

1、Please relax these holes tolerance to +/-3mil, please confirm kindly.2、Please relax these holes tolerance to +5/-1mil, please confirm kindly.Question description: You required us tolerance of the hole size as +/-0.1mm in the file of ―P840 read me.txt ―, but it is unmatched with ‖hole size tolerance as +0.1mm/-0mm ‖ in the file ―spec.gbr‖ and the tolerance as +0.1mm/-0mm is too tight for us to control.GF Suggestion: We will ignores this difference and to control the tolerance of the hole size as +/-0.10mm, please kindly confirm.（44）没有PAD的PTH孔

Question description：All holes had been defined as PTH hole, but some holes(1Xφ4.1mm and 4Xφ6mm and 1Xφ10mm)had no copper PAD and located at base material.GF Suggestion：1.We will build these holes as NPTH holes.2.We will build these holes as PTH holes without annular ring on both sides.（45）大小孔叠孔

Question description：The two holes were located at the same position, one is φ6mm and the other is φ10mm, see picture below.GF Suggestion：1.We will delete dia.6mm hole and to be build dia.10mm hole.2.We will delete dia.10mm hole and to be build dia.6mm hole.（46）孔太大,改变公差被ROUT出

Question description：Because the φ10mm holes was too big for us to drill out, and we would like to rout it out, please accept the tolerance as +/-0.1mm.GF Suggestion：Please kindly confirm.（47）过油孔

Question description：All of the dia.0.4mm holes had no S/M opening on both sides, and 6Xdia.0.8mm holes had no S/M opening on one side, We will build these holes as solder mask can flow into holes but not plug them for no solder mask opening side.GF Suggestion：Please kindly confirm.（48）没有定义孔的属性

Question description：The holes attribute was undefined, checking the original Gerber: 6*dia.188mil & 4*dia.100mil & 2*dia.125mil and 8x slots was drilled on base material, we would like to build this holes and slot as non-plated one;others we would like to build them as plated holes.GF Suggestion： Please kindly confirm.（49）孔的尺寸和样板不一致

Question description：We have found the hole sizes in sample board mismatch with which are indicated in GERBER data.Please see the discrepancy in fig3.GF Suggestion：1.Please provide the finished hole sizes for us.2.The finished size of non-plated hole is Φ1.15mm.Regard the two plated holes we pointed out in fig3 as Φ1.10mm holes.The others follow GEREBR.（50）增加工具孔和对位光点和DUMMY PAD Question description：From feedback of other company‘s engineer question, require adding tooling hole, but we cannot find the corresponding tooling holes in drawing and customer require add fiducially mark, but in file ―CS-paste‖ & ―SS-paste‖, we find only add fiducially mark opening(φ2.00mm)on both sides, but have no the size of fiducially mark.detail place(Detail panel drawing see 4054099a0.pdf,add tooling holesφ2.0mm(3x)and fiducially markφ1.0mm(3x)solder masker openingφ2.0mm).GF Suggestion: We will according to file ―CS-paste‖ & ―SS-paste‖ and customer‘s require, design panel drawing(include the size of fiducially mark and opening and tooling holes)(detail panel drawing see 4054099A0.pdf), please confirm!We would like to add dummy pad at breakaway tab on both sides in order to improving process.（51）孔的公差太紧，建议放松公差

Question description： The DIA.166mil holes tolerance +3/-0mil is too tight for us to control(see fig below)

GF Suggestion： Please relax the tolerance to +4/-2mil.Question description：Such as Q1.jpg pointed, the hole true position tolerance +/-0.03mm is too tight to produce.GF Suggestion：Please allow relaxing the tolerance from +/-0.03mm to +/-0.076mm.Question description：Customer required the finished board thickness 1.6+/-0.1mm,see fig01;this tolerance is too tight to control in our produce.GF Suggestion：Please relax the tolerance +/-0.10mm to +/-0.15mm.Question description：Customer required the tolerance of NPTH size: +/-0.025mm;PTH size: +/-0.05mm are out of our capability，see fig01, we cannot control them.GF Suggestion：Please relax the tolerance: NPTH size:+/-0.025mm to +/-0.05mm and PTH size:+/-0.05mm to +/-0.075mm.Question description：It required ―tolerance: +/-0.05mm‖ in the drawing, but the tolerance is too tight for us to control.GF Suggestion： We will control PTH tolerance is +/-0.076mm,NPTH tolerance is +/-0.05mm, slot hole tolerance is +/-0.1mm, profile dimension tolerance is +/-0.15mm.(52)过电孔top面绿油入孔但不塞孔，bottom面按原稿,开窗制作

Question description： In artwork of original design the 19.7mil holes have no solder mask opening only on topside.GF Suggestion： For this 19.7 mil via holes on topside we will only cover the pads and allow ink flowing into holes, on bottom side we will follow original design.(53)孔尺寸不对 Question description: See the figure below, the size and count of some NPTH hoes in the ―Spec.gbr‖ is unmatched with hole chart in ―dwg1.gbr‖

GF Suggestion: We will ignores these differences and follows the Gerber to build as the hole chart in ―dwg1.gbr‖

（54）孔公差

Question description：Undefined the tolerance of the holes.GF Suggestion：+ /-0.076mm for PTH holes and + /-0.05mm for NPTH holes.（55）孔到边公差

Question description：There was no dimension tolerance of hole to edge.GF Suggestion：In order to smooth our process, we would like to control it as +/-0.13mm.（56）公制孔径与英制孔径，选用英制孔径

Question description： The Metric hole size in the drill drawing are mismatched with English hole size in drill file.GF Suggestion： We suggest following the Metric hole size in the drill drawing to build.（57）孔图是公制，钻带说明文件是英制，不匹配

Question description： Mismatched holes size between the hole drawing(Metric)and file‖TP1-05.rep‖(English)

GF Suggestion ： Follow hole size in Metric in hole drawing。

3.Opening.Pad（1）光点开窗过大，导致保护铜环露铜

Question description：The S/M opening of the fiducially marks is so big that protective ring is exposed, we can‘t make sure if it will effect your assembly.GF Suggestion：

1、We will follow Gerber to build, protective ring exposed is allowed.2、We will reduce the S/M opening to avoid protective ring exposed.（2）光学点开窗太大，导致附近的线路露铜

Question description：In Gerber file the S/M opening of this fiducially mark is so big that the circuit nearby is exposed.(See fig below)GF Suggestion： We will shave the S/M opening in order to avoiding the circuit exposed.（3）SMT的绿油开窗太小

Question description：In the Gerber file some solder mask opening is smaller than SMD PAD, GF Suggestion： We will follow Gerber to build, and allow solder mask to be covered on the SMD.（4）NPTH孔绿油开窗大，建议削铜制作

Question description：In Gerber file, four DIA φ3.50MM holes drilled on the big copper pads on the Top and bottom side circuit layer.But you defined them as NPTH.See fig below。GF Suggestion ：

1、We will build these holes as PTH, please confirm kindly.2、We will build these holes as NPTH, we will shave copper to get 10mil clearance away from hole edge on both sides with easy to process.Question description：We found some DIA.4.00mm holes are drilled on copper in inner layer.GF Suggestion： We will shave copper to get 10mil clearance around the DIA.4.00mm holes, please confirm kindly.（5）部分PAD位没有开窗，不确定是否为正常设计

Question description：See fig below, no S/M opening for some pads, we can‘t make sure if it is your normal design.GF Suggestion：We will follow Gerber to build, please confirm kindly.（6）文件中有些多余开窗

Question description: See the figure below, we found some extra S/M opening;it may cause some circuit or copper exposed.GF Suggestion: We will delete these extra S/M opening, please kindly confirm.（7）绿油开窗太大，线路导致露铜

Question description：In Gerber file the S/M opening of is so big that the circuit nearby is exposed.(See fig below)

GF Suggestion： We will shave the S/M opening in order to avoiding the circuit exposed.（8）板中有些“+”符号没有开窗

Question description：―+‖ Symbol have no solder masker opening in top layer.(See fig below)

GF Suggestion：We will follow Gerber file to build.（9）绿油边窗

Question description：The solder mask opening of the board edge is so big that we can‘t make sure if we need to delete it.GF Suggestion：

1、We will delete the solder mask opening of the board edge, please confirm kindly.2、We will follow Gerber to build.（10）对位光点开窗过大

Question description：It was so big for the S/M opening of fiducially marks and the protected ring was exposed.GF Suggestion：Decrease the S/M opening to avoid exposing protected ring.（11）内层非功能PAD删除，为了降低报废率

Question description：There are non-functional isolated pads in inner layer If them have been removed then it will be helpful for improving quality and production.GF Suggestion：So please kindly permit us to remove these non-functional pads in inner layers.（12）加DUMMY PAD Question description：We would like to add dummy pad at breakaway tab in order to improving process on both sides.GF Suggestion：Please kindly confirm.Question description：There is no dummy pad on tab in panel Gerber.GF Suggestion：Add dummy pads on tab to optimize the distribution of electric current.（13）PAD离外形太近。1.刮铜。2.允许露铜

Question description： Copper pads are too close to profile please see fig 2 question 6.GF Suggestion： 1.Shave pads a little to keep 10 mil gap away from profile Avoid copper exposing at board edge after fabrication.2.Follow Gerber design and allow copper exposing at board edge.（14）除独立（非功能）PAD Question description：There are non-functional isolated pads in inner layer If them have been removed then it will be helpful for improving quality and production.GF Suggestion：Please kindly confirm.（15）Pad离板边太近

Question description：Some pad is so closed to the board edge that copper will be exposed after fabrication GF Suggestion：

1、We will shave the pad 0.25mm away from the board edge to avoid copper exposed.2、We will follow Gerber to build, copper exposed at the board edge is allowed.（16）板边PAD露铜

Question description: Some pad is extending the outline, see fig below, after routed, the copper pad would be exposed at the slot edge, and the pad maybe breaks out.GF Suggestion：

1、Follow artwork and the copper pad exposed at the slot edge and these pad broken-out is acceptable.2、We will shave the copper to get 10mil clearance away from the slot edge to avoid copper exposed at the slot edge，but please allow these pads will be broken out.（17）PAD离NPTH孔太近

Question description: See the figure below, we found some pad is so clear round the NPTH.GF Suggestion: We will shave the pad and to get 0.25mm away from the NPTH to ensure enough free room for dry film tenting.（18）光点增加DUMMY PAD Question description： In order to avoid the fiducially marks to be peeled off in our process, we would like to add dummy pad on the breakaway.GF Suggestion： Please kindly confirm.（19）SHAVE PAD 不露铜

Question description： We will shave copper around break-off hole to avoid copper be exposed.GF Suggestion： Pls.kindly confirmed.（20）方PAD设计的圆形绿油窗

Question description: In Gerber file, the pad on the circuit layer is square ,but the solder mask is round ,we don‘t know if it is normal design，the solder mask maybe cover the pad.GF Suggestion：1.We will think it is normal design, and follow Gerber file to build.2.We will coordinate the S/M opening shape to square and avoid solder mask covering the pad.（21）客户要求6MIL的焊环，我们很难做到，建议做2MIL Question description： Customer required ―annular ring to be 0.006 inch minimum‖, it is tight for us to control.GF Suggestion：We will control 2mil annular ring in finished product.Question description: You required us ―minimum copper in the hole is 0.0015‖, but it is very difficult for us to build.GF Suggestion: We will build this board as the minimum copper in the hole is 0.001‖, please kindly confirm.（22）RING 太大

Question description: Note 3: it stated ―„„„„ALL HOLES SURROUNDED BY LAND SHALL HYAVE A MINIMUM ANNULAR RING OF.005‖ ‖, but it is difficult for us to control the minimum annular ring of 5mil.GF Suggestion：We will control the annular ring 2mil(min.)in finished product, please confirm kindly.4.Component Mark（1）将板中的MADE IN USA 改为MADE IN CHINA Question description： See fig below, there are etching text ―MADE IN USA‖ in the board, we can‘t make sure if we need to delete or change it to ―MADE IN CHINA‖.GF Suggestion： We have changed it to ―MADE IN CHINA‖ in working Gerber, please confirm kindly.Question description: We found some legends as ―made in USA‖ on the top side of silkscreen, in order to avoid causing trouble during custom inspection, we need change it into ―made in china‖ or delete.GF Suggestion :

1、We will delete ―MADE IN U.S.A‖, Please confirm kindly.2、We will change it to ―MADE IN CHINA‖, please confirm kindly.3、We will peel able S/M material covering in ―MADE IN U.S.A‖, Please confirm kindly.（2）板中的某些字符需镜像

Question description： The text ―1‖ is abnormal in top and bottom side that viewed from topside.(See fig below)GF Suggestion：We will mirror this text please kindly confirm.（3）在GERBER文件的板边有一些文字

Question description：In Gerber file, there is text‖ANT-0585/41-00160‖ in tab area of all layer(see figure 2)

GF Suggestion： 1.Follow Gerber file to build.2.Delete these texts of all layers.（4）字符在工艺边上，我们不确定是否需要保留

Question description：Some legend is located on break tab, we can‘t make sure if we need to remain it, see fig blow GF Suggestion：We will leave it, as it is, follow Gerber to build.（5）有些字符上大锡面，而无处可移的

Question description：Some legend are located on big response pads, See fig below, we can‘t make sure how to build。

GF Suggestion： We will follow Gerber to build, please confirm kindly.Question description： Like fig below, some legend are located on component pads.GF Suggestion： We will follow Gerber to build, allow legend to be covered on these pads, please confirm kindly.Question description：Some legend are located on the big component pad, see fig below.GF Suggestion ：

1、We will shave legend to avoid legend located on pads.2、We will enlarge legend to avoid legend located on pads.（6）SMT间的白油桥做不出，需建议删除

Question description：There are character bridges between the Pads on the board.There is only 10mil distance between the SMD Pads.It is out of our capability to fabricate the character bridge.(We need 16mil distance to fabricate the character bridge out.)GF Suggestion： We will delete these character bridges between the Pads.Please confirm.（7）字符上PAD，而可以移动的

Question description：Some legends are located on the big component pad, see fig below.（Silkscreen letter lie on copper with solder mask opening）GF Suggestion ： 1.We will Move these letter to avoid these letter lie on copper with solder mask opening.Please confirm kindly.2、Follow Gerber file to build.（8）字符设计在线路上，开窗露铜

Question description：Some S/M opening legend is located on circuit, these circuit will be exposed, we don‘t know if it is normal design, see Fig2 in file ―fig.Pdf‖.GF Suggestion：Move the S/M opening legend to avoid circuit to be exposed.（9）客户说有两面字符，但资料只有一面字符

Question description：You tell us that ―SCREEN MARKING ON TOP SIDE OF BOARD.USE TWO-PAR WHITE EPOXY INK‖, there are only top silkscreen layer in the Gerber, we don‘t quite know the meaning ―USE TWO-PART WHITE EPOXY INK.‖

GF Suggestion：

We will ignore the information ―USE TWO-PART WHITE EPOXY INK‖, and only to print the top silkscreen in white epoxy ink, please confirm kindly.（10）客户的资料中有字符层但说明文件不需印字符

Question description：You required that no need to print legend on this board in the specification, but there are component legend in Gerber.We have print white legend on the board according to the Gerber data in the first sample board.GF Suggestion: We will follow the sample board, print legend on the board, please confirm kindly.（11）不能确定客户是否需要加DATE CODE Question description：We can‘t make sure the date code pattern that your required, WWYY(week-year)or YYWW(year-week)

GF Suggestion：

1、We will add the date code as WWYY, please confirm kindly.2、We will add the date code as YYWW, please confirm kindly.（12）建议增加ULLOGO及DATE CODE在板上

Question description： We will add our UL logo & date code(wwyy)and Made In China by component side silkscreen.See fig below.GF Suggestion：Please confirm kindly.（13）客户需要增加一些文字，但没有指定地方

Question description：Customer require to add ―Made In China‖ in PCB board, but don‘t show use which mode to add

GF Suggestion：We will add ―Made In China‖ in top silkscreen, position see figure 1

（14）客户只提到加DATE没有提到是否加ULLOGO Question description：You only required us to add the date code on , we don‘t know if we need to add our UL logo on the board.GF Suggestion:

1、Only add date code on the board，no need to add UL logo。

2、We will add our UL logo and date code on the board as usual，please confirm kindly。

Question description：We didn‘t find other vendor‘s UL logo on the board in scan0001.JPG.GF Suggestion：We will add our UL logo and date code(YYWW)in negative solder mask on bottom side.（15）建议增加ULLOGO及DATE CODE在工艺边

Question description：There is no enough place to add our UL-logo and Date-code(WW-YY)on the unit.We will add them only on the breakaway“topmask.dpf”layer。(The position as arrow pointed).GF Suggestion： Please kindly confirm!（16）信息不明白

Question description：We don‘t know these words meanings as fig below.GF Suggestion：1.Ignore this information, please confirm kindly.2.Please translate this information for us in English or Chinese.Question description：This is a 2-layers board, but there were two files ―42f14ba.GP1‖ and ―42f14ba.GP2‖ which were the same, and we don‘t know whether they are inner layers or not.GF Suggestion：1.Build this board as 2-layers and ignore these two files.2.We will build this board as 4-layers board, and build these two layer as inner layer, and all the inner layer is the same, please confirm kindly.3.Please give us your advice in detail.（17）字符上PAD Question description：Some legend are located on the big component pad, see fig below.GF Suggestion ：We will move the legend like fig below, please confirm kindly.（18）板边的文字很难辨认

Question description：From scan0001.JPG, we can found that there are some texts on the tab, but they are illegible, please see new-fig1.GF Suggestion：1.Ignore them.2.If they are the texts we should add on the tab, please tell us the detail.（19）板中文字很难辨认

Question description：In Gerber file, we found that there are some texts in ‖ silktop.gbr‖ on the board, but they are illegible.See fig below.GF Suggestion：We will ignore them Follow Gerber file to build.（20）板中的文字有重叠

Question description：Some legend are superpose, see fig below.GF Suggestion ：We will Move these letter as fig below, please confirm kindly.（21）板中的文字有超出板外

Question description：Some legend are out of the board，See fig below, we can‘t make sure how to build。GF Suggestion： We will move these legends into the board, see fig below, please confirm kindly.Question description：Some legend is out of the board, see fig below.GF Suggestion：We will delete these legend out of the board, please confirm kindly.（22）两面字符是相同的

Question description: The legend on both side is the same, we can‘t make sure if it is normal design.GF Suggestion： We will think it is normal design, and follow Gerber to build, please confirm kindly.（23）字符在板边，V-CUT会被伤到，建议移到另一边

Question description: to avoid the letter be damaged by v-score, we would like to move these letters to the right side of the board, see fig GF Suggestion： Please kindly confirm.（24）字符层数的澄清

Question description： In the file ―PCB_PROTECTL-000A-FAB.pdf‖ note 7, it states that the board only needs to print the component side silkscreen layer.But in the Gerber data, there exists two silkscreen layers.(See fig01.jpg)GF Suggestion：1.follow the Gerber design and the board needs to print the silkscreen on the both sides.2.ignore the solder side silkscreen layer in the Gerber data and the board just needs to print silkscreen on the component side.（25）字符入孔

Question description: In artwork file, there is text that is located in NPTH hole in top silkscreen(see figure 1).GF Suggestion：1.We will delete these texts.2.We will move these texts to suitable position.Question description：Some legend laid on pad and fell into holes.GF Suggestion：We would like to remove the legend on the pad.（26）白油字与铜字重叠

Question description: In artwork file, text in top silkscreen and copper text is partly overlapping(see figure 2).GF Suggestion：We will move silkscreen text to suitable position to ensure that silkscreen text isn‘t overlap with copper text.（27）字符上SS面焊环

Question description：Some characters in the solder side silkscreen layer are overlapped the solder pad, we do not know if it is normal design.(See fig02.jpg)GF Suggestion: 1.noarmal design and follow cad to do, the silkscreen characters over the solder pads is acceptable.2.delete the silkscreen characters, which overlapped with the solder pad.（28）加我司UL、logo、Date code GF Suggestion： We will add our company UL logo and date code 8888(yyww)by component side silkscreen.Please confirm!（29）字符双面与单面的小纠纷 Question description： It noted the solder side silkscreen as white(see fig02), but in GERBER file only the topside silkscreen existing.GF Suggestion： We suggest following the GERBER file to precede the topside silkscreen color as white only and no solder side silkscreen.（30）加我司UL logo & date code于CS面

Question description： We will add our UL logo & date code on silkscreen layer, approximately location shown as fig01 GF Suggestion： Please kindly confirm！

（31）存在客户logo Question description：Other vender‘s logo has existed on tab.GF Suggestion：We will replace the existed logo on tab with our UL Logo and date code(see attached picture).（32）蚀刻字反字

Question description：The etching layer number in layer 1 is opposite from layer 1 viewed, we can‘t make sure if we need to mirror these etching numbers, see fig below.GF Suggestion：

1、We will follow Gerber to build，please confirm kindly、2.We will mirror the etching layer number, please confirm kindly.（33）文字过不了CIQ Question description：There are text ―Proudly MADE in the USA by MURPHY SWITH OF CA‖ in the legend layer, if we follow Gerber to build, there are some law question when passing the CIQ, see fig below.GF Suggestion：We will cover these legends with peel able mask when delivery, but you need remove these peel able mask after you received

（34）字符移动或者删除

Question description：Component mark lies on solder area at some places, see picture below.GF Suggestion：Move characters away from solder area, and delete the silkscreen lines on solder area.（35）没有字符层

Question description: You said not required silkscreen and it have no silkscreen layer in the Gerber too, but at the same time, the ―P840 EXTENTS.GBR‖ list including‖ CSCP.GBR: COMP SIDE IDENT‖ and we are not found this file, we are not sure if this board need silkscreen or not, see the figure for detail.GF Suggestion: We will ignore this difference and follow the Gerber to build this board without silkscreen, please kindly confirm.。

（36）没有地方增加LOGO Question description：This board is so small that there is no space to add UL logo and date code.GF Suggestion：We will add our UL logo and date code(YYWW)on the rail.（37）客户的PO要求蚀刻ULLOGO及DATE CODE，但没有指明哪层

Question description: In ―work sheet‖ the customer required etch the logo and date code, but no define which Side to etch them.GF Suggestion： We will add it as attached picture indicated.Please confirm!（38）字符超出外形框

Question description: in the topside silkscreen layer, some characters are extended out of the board.(See fig05.pg)GF Suggestion： Follow the Gerber design and we would delete the contents, which have extended out of the board.Please confirm.（39）阻焊层的文本，需要镜像

Question description：The text ― SOLDER SIDE PWB 3200016 REF B‖ is in its backside if viewed from solder side.(See fig01)GF Suggestion： Mirror these text, please kindly confirm.（40）图案与字符阻焊重合

Question description： The characters ―0‖ were laid on the copper, solder mask and legend at the same place on the breakaway.GF Suggestion：We would like to delete the character ―0‖ on the legend.5.File，Information，Dimension（1）多余的文件

Question description：There are some introductions files, such as ―Av155302.rep, Av155302.sim, Read me txt, Av155302.fpr‖, exist in the customer‘s data.Because they are not translated into English。We cannot understand what they mean.GF Suggestion： We would ignore them and just follow the Gerber data to build the board.Please confirm.（2）客户SPEC文件，不存在，继续使用IPC –A-600F CLASS 2 Question description: the spec BS9763 is shown in the file ―8601284-3-sht1.pdf‖, but we do not have it in hand.(Details see fig01.jpg)GF Suggestion： Ignore the spec and follow IPC –A-600F CLASS 2 to do.Please confirm.（3）我们打不开某个文件

Question description： We cannot open the file‖66-0800-81(4).PDF‖.GF Suggestion：1.Please make it to.JPG format。2.We will disregard this file.Question description： we don‘t unfold “Test point Report forR7597-r4.tsp” and don‘t know the file that is merit or not.GF Suggestion： We suggest ignoring it, please confirming.（4）PDF文件打不开

Question description： We cannot open the file ‖mhtml-mid—00000624-.PDF‖.GF Suggestion：1.Please make it to.JPG format 2.We will disregard this file.Please select.（5）非英文信息

Question description：In technical Specification, we don‘t understand some non-English information that is not translated into English.GF Suggestion：Please kindly confirm.。（6）增加批号等

Question description：Please confirm the format of date code and batch code that customer required to add on the board.GF Suggestion：Please kindly confirm.。

（7）某些文件打不开，建议忽略

GF Suggestion： We will ignore this file, please confirm kindly.Question description：We don‘t how to use the file“PLOT.GBR‖.GF Suggestion ： We will ignore this layer, please confirm kindly.Question description： We can‘t open the file ―A-283-1.GWK‖.（8）客户提供的资料页数不够

Question description：See fig below, you marked the sheet as 1/9, we can‘t make sure。If there are 2/9，3/9„„ and so on.We have not found these sheet 2/9, 3/9 and so on.GF Suggestion：We will ignore the sheet 2/9„„„„，please confirm kindly.（9）客户的版本号不同

Question description：In file ―FAB‖ layer REV D, but we have in file ―SL1‖layer have found REV C.see fig below。

GF Suggestion：We will follow Gerber to build, and ignore this difference, Please confirm kindly.（10）客户同时提供单元及套板两种文件

Question description：Both Gerber in unit and in panel form are provided, but not state if we will fabricate per unit Gerber or panel Gerber.GF Suggestion：Fabricate per panel Gerber, and the unit Gerber use for reference only.（11）没有用的文件

Question description：We considered the explanation indicated in ―63slots.gko‖ was not for us to production, we would like to just follow Gerber data to do, please see enclosed picture.GF Suggestion： Please kindly confirm.（12）C/S面视图说明

Question description：In the panel drawing, we considered two units shown in panel was view from component side(top side).GF Suggestion： Please kindly confirm。

（13）客户没有注明油墨颜色

Question description：We haven‘t found some information about the solder mask color.GF Suggestion：We will print the solder mask in Green color as usual.（14）客户指定的油墨我司没有

Question description：You required us to solder mask in color Green(semi-gloss), but we have not had this kind color of solder mask by hand.GF Suggestion：

1、We will use solder mask in color glossy green on both side, please confirm kindly.2、We will use solder mask in color matte green on both sides, please confirm kindly.Question description: We haven‘t had ―SR-1000‖ solder mask by hand.GF Suggestion： We will use the solder mask that we used as usual, please confirm kindly.（15）客户注明板材我司没有

Question description：In Gerber file, you defined ― fabricate using F4 material‖, but we don‘t have this material.GF Suggestion：We will ignore this information, we used as usual FR-4 KB material, please confirm kindly.（16）客户的PO的编号与GERBER中的编号不同

Question description：We found the Cust.P/N‖P17091 ―in PO.Is unmatched that we found in Gerber ―7A80001‖

GF Suggestion： We will follow the Gerber to build, ignore this difference.（17）

Question 客户所提到的SPEC没有

description

：

On “PCB_202299_C_yy_zzz_+71_A_Fujitsu_charger PCB.Pdf‖, it noted the spec: ―DIN7168 section 1,Tolerance level middle ―See fig below, but we have not this specification that you mentioned.GF Suggestion：Ignore this spec and follow the specification:IPC-A-600F CLASS 2 to build in this sample the we supplied, but if mass production, please resend the specification ―DIN7168 section 1”.Question description：On drill drawing, it noted the spec: ―BS4584‖,―BS9761 MULTILAYER ― and ―BS219‖(see fig01), but we have not this mentioned spec.GF Suggestion： 1.Please customer provides them A.S.A.P so that we can start our fabrication in time.2.Ignore these mentioned spec and follow the standard of IPC-A-600F CLASS 2 to proceed.（18）客户提供两套资料Gerber and PCB Question description：You have supplied two kind of artwork, Gerber and ―*.PCB‖

GF Suggestion：We will ignore this PCB file, follow Gerber to build, please confirm kindly。

（19）SPY/ST的客户没有提供图纸于我们

Question description: We haven‘t received the fab drawing for this board.GF Suggestion :

1、Please send it to us.2、We will ignore this drawing, please confirm kindly.（20）阻焊型号和颜色

Question description：The solder mask type and color was unknown.GF Suggestion： LPI green was acceptable, please kindly confirm.（21）丝印型号和颜色

Question description：The silkscreen mask type and color was not defined.GF Suggestion： Non-conductive ink white was acceptable, please kindly confirm.（22）阻焊油型号澄清

Question description： We thought the type of the solder mask should be ―TAIYO PSR 4000‖ but not ―TAYO PSR 4000‖.GF Suggestion： Please kindly confirm.（23）阻焊颜色

Question description: Note 5: it stated ―„„„„SOLDERMASK TO BE PER IPC-SM-840, TYPE, CLASS 3, COLOR TRANSPARENT GREEN.‖ But we have not had the solder mask in transparent green.GF Suggestion：

1、We will use the solder mask in color glossy green that we used as usual ―LM-600 GH-7‖.2、We will use the solder mask in color matte green that we used as usual, please confirm kindly.（24）没有定义表面处理

Question description： Didn‘t indicate the surface treatment from our customer.GF Suggestion： HASL + SMOBC was acceptable, please kindly confirm.（25）建议客户用IPC-A-600F CLASS 2做SPEC Question description：You have not defined some information(like hole size tolerance, dimension tolerance and so on.)GF Suggestion： For this information that you have defined, we will follow specification IPC-A-600F Class 2 to build, don‘t ask again.（26）只有一层阻焊

Question description：Only solder mask bottom side layer in CAD.GF Suggestion： 1.Print solder mask on both sides.But on topside solder mask will cover pad & fall into hole.2.Print solder mask only on bottom layer.Tin/Lead will cover NO solder mask on topside and all conductors and pads.3.Please provide us solder mask topside。4.Use same solder mask for both sides.（27）只有一层阻焊绿油

Question description：Only one solder mask film is in the Gerber file.GF Suggestion： Use this one solder mask file to print on both sides.（28）单面阻焊

Question description：In Gerber file only one solder mask layer.GF Suggestion： We will use the same one solder mask layer on both sides, please confirm kindly.（29）双面共用一面阻焊

Question description：In file“ FAB‖, you required ―solder mask on both sides of board‖, but we only find one solder mask layer.GF Suggestion: We will print the layer on both sides, Please confirm kindly.Question description：Only provide one side solder mask file in Gerber data。

GF Suggestion:

1、Use same solder mask for both sides 2.Please give other suggestion。

（30）只有三层线路图形

Question description：Only three copper layers are in the Gerber file, so this board should be three-layer board.If we follow Gerber and build this board as three-layer, the board will have large bow & twist due to unsymmetrical structure.GF Suggestion： 1.Add one copper layer to aid the laminate, and this copper layer will be open with other layers, please kindly confirm.2.Follow Gerber and build this board as three-layer, and the large bow & twist(2.0%)is acceptable.（31）信号层与电源层澄清

Question description： In customer‘s lay-up details, the note for layer 4 is ―1oz Cu/GROUND PLANE‖, but in the original Gerber design, the layer 4 is obviously single layer.(See fig02.jpg and fig03.jpg)GF Suggestion: Ignore the note for layer4 in the lay-up details, and follow the Gerber design to do;the layer 4 is a signal layer.Please confirm.（32）阻抗被要求，但线宽没有被要求

Question description： The impedance is required in the lay-up details, but it is not shown which line needs to control.GF Suggestion: According to the Gerber design, we would control the 6mil line in the layer1, layer3, layer4 and layer6 with the impedance as 62+/-10%ohms.Please confirm.（33）没有指明层压顺序

Question description：The layer stack up sequence is not specified.GF Suggestion：We will follow the sequence as a4-283_1_top.ger---a4-283_1_L2.ger--a4-283_1_L3.ger a4-283_1_BOT.ger‖, please confirm kindly.（34）调整层压结构

Question description：We can‘t meet your impendence requirement according to your lay-up structure.GF Suggestion： We will coordinate the lay-up structure like below（35）关于标准

Question description：“Solder plate per QQ-S-571‖ is mentioned in drawing, but we do not have this spec.GF Suggestion：Disregard this spec, and we will control the solder coat quality with IPC spec.（36）标准

Question description：We haven‘t the standard ―EH&S 1001‖ shown in the *.pdf files.GF Suggestion： 1.We would like to ignore these specs and follow IPC standard.2.Please send them to us.（37）确定D-CODE形状

Question description：We can‘t make sure the decode shape that you defined ―L‖ ―R‖ ―C‖.GF Suggestion： We will regards ―L‖ as line, ―R‖ as rectangle, ―C‖ as circle, please confirm kindly（38）PN不对

Question description: The cust.P/N ―P1291 ISS A‖ in the Gerber is unmatched with ―P840‖ in the PO.GF Suggestion: We will ignores this difference and follows the Gerber to build, please kindly confirm.（39）建议使用原始Gerber资料做板

Question description：We received original Gerber data and 1-up working Gerber data at the same time, we considered the working Gerber data was only for reference, and we would like to use the original Gerber to build this board.GF Suggestion： Please kindly confirm.（40）客户有PANEL图，但没有注明PANEL尺寸的

Question description：You haven‘t defined the rail size, we can‘t make sure how to build the panel, and so we had a new panel drawing ―2005047A0.PDF‖ and defined the rail size.GF Suggestion：Please confirm the new panel drawing.‖2005047A0.pdf‖ Question description：We have a new panel drawing according to your paste file, but we can‘t make sure the tooling holes size, stamp holes size and fiducially marks size, we have defined the holes size, stamp holes size and fiducially marks size in the panel drawing.GF Suggestion：Please confirm the panel drawing.（41）客户的传真与GEBER FILE的拼板尺寸不同

Question description：The panel drawing in Gerber is different from the panel drawing that you faxed, we can‘t make sure follow which to build, but we have drawing a new panel drawing according to the panel drawing that you faxed see file ―2018022A0.pdf‖.GF Suggestion: Please confirm our new panel drawing kindly.Question description: The dimension that you marked in the file ―*.dwg‖ is unmatched that we measured in Gerber data.GF Suggestion：We will follow the dimension that we measured in Gerber data to build.Question description: Two dimensions marked on drawing are not matched with that measured in Gerber.(See fig01)GF Suggestion：Follow Gerber outline to build, please kindly confirm.（42）标注的尺寸与实测不一致

Question description: You told us the panel dimension is 8.20‖X8.20‖in file ―README_ENG-1620-GBZ.txt‖, but we found the panel dimension is 8.02‖X8.02‖.GF Suggestion：We will follow the dimension 8.02‖X8.02‖ to build the panel, please confirm kindly.Question description：The board dimension that you supplied‖0.250 inch‖ is unmatched that we measured in Gerber data ‖0.293 inch‖.GF Suggestion：We will follow the dimension that we measured in Gerber file to build ‖0.293 inch‖, please confirm kindly.（43）PTL的尺寸和Gerber 尺寸不同

Question description：The dimension that you supplied ‖229*280mm‖ is unmatched that we measured in Gerber data ‖228*290mm‖.GF Suggestion：We will follow the dimension that we measured in Gerber file to build ‖228*290mm‖, please confirm kindly.（44）封闭尺寸的询问

Question description： We can‘t control the dimension shown in the drawing at the same time, because they were in a circle chain, and we would like to take some dimension as reference.GF Suggestion： Please kindly confirm.（45）外形图中的尺寸与Gerber尺寸不符

Question description：Some dimensions shown in the file ―av155302.pdf‖ page 12 mismatch with what we measured from the Gerber data.(See fig02.jpg)GF Suggestion： Ignore the shown dimension in file ―av155302.pdf‖ and follow the Gerber data to build the board.Please confirm.（46）有一些外形图中的尺寸，无意义

Question description： We cannot find the corresponding patterns for some dimension shown in the file ―av155302.pdf‖.(See fig02.jpg)GF Suggestion： Ignore them.（47）确认，附图是交货板的具体尺寸要求

Question description： Attached ―Panel drawing.jpg‖ is the panel drawing with rails Please kindly confirm.GF Suggestion： Please kindly confirm.（48）外形尺寸不一

Question description: The unit dimension‖72.8mm x50.6mm‖marked in ―P840 read me.txt‖ is unmatched with ―78.49x50.5‖ we measured in the Gerber.GF Suggestion: We will ignore this difference and follow the Gerber to build.（49）尺寸不一致

Question description： We found it‘s mismatched for the dimension shown in the *.gm4 and measured in *gm4.GF Suggestion： We will follow the outline of *.gm4 to build and take the dimensions shown in the *.gm4 as reference.（50）没有孔到边的尺寸

Question description： There was no dimension of one hole to the edges, and we can‘t make sure the outline of the board according to the mechanical layer *.gm4.GF Suggestion： Please give further advice.（51）SLOT尺寸不明

Question description：The slot size was unknown, measured from the Gerber data, we would like to build them with 200*325mil.GF Suggestion： Please kindly confirm.（52）蚀刻公差太紧 Question description：You required us the finished trace width should be within 5% of the supplied Gerber, but it is very difficult for us to build.GF Suggestion：Please relax the finished trace width with 20% of the supplied Gerber.（53）把铣出孔的公差由+0.1/-0mm要求放宽到+0.2/-0mm Question description: The tolerance shown in the file ―8601284-3-sht1.pdf ― +0.1/-0mm is tight for us(See fig01.jpg)GF Suggestion: 1.pls kindly relax the tolerance to +0.2/-0mm.2.pls give other advice.（54）板对位公差

Question description:In the file“700-0125-20-A-2.doc‖,note.LAYER TO LAYER REGISTRATION SHALL BE WITHIN 0.003„„„„ GF Suggestion： Please relax the layer-to-layer registration to 0.005‖.Question description:In the file note ‖Layer to layer registration of pattern shall be within 0.004in or 0.1mm‖ and ―with an absolute minimum of 0.002in or 0.05mm between plated…‖, it‘s too tight to control.（55）边到边公差

Question description ：It required ―Tolerance +/-0.15‖ in specification;we will control the dimension tolerance of edge to edge as +/-0.15mm.GF Suggestion：Please kindly confirm.6.Profiling（1）内角问题

Question description：We can‘t make the inner angle as right angle, see fig below.GF Suggestion：We will control these inner angle as R0.5mm round corner.Question description：In original design, some inside corners are right angle, it is impossible to make according to our process.GF Suggestion：We will control inside corner as R0.8mm(MAX).（2）SLOT槽的内角

Question description: These slots are rectangle shape, we can‘t make out the inside right angle.GF Suggestion： We will control inside corner as R0.5mm(MAX).（3）SLOT槽的有效长度的询问

Question description： In Gerber file，there are some square slot in the drawing, but we can‘t make out the square slot because the inner angle is unavoidable.GF Suggestion：

1、We will build the slot as fig A below, please confirm kindly.2、We will build the slot as fig B below, please confirm kindly.（4）V-CUT 客户没有设计到两边

Question description： In drill drawing V-cut don‘t extend to tab area.GF Suggestion：V-cut extend to tab area。

（5）外围不同

Question description：The unit outline is unmatched that in panel, see fig below.GF Suggestion：We will follow the panel Gerber to build the outline(file ―ccltop.gbrr‖), and we will ignore the file “ccl.brd”，please confirm kindly.（6）单元太小，建议拼板制作

Question description：The size of unit: 70x70mm is too small;this will go against mass product.GF Suggestion：

1、We will accord to the size of unit, design panel drawing.Detail panel drawing see 4054099a0.pdf,add tooling holesφ2.0mm(3x)and fiducially markφ1.0mm(3x)solder masker openingφ2.0mm).2.We will build these board panel in drawing ―2009018a0.pdf‖, but we will separate these board to units before delivery, please accept little burr at the board edge.3、Please give other suggestion.（7）此板不确定是否需做出V-CUT Question description: In Gerber file, it looks like that the board is consisted of sixteen small board, but the small board profile is absent，and no V-cut between these small board, we can‘t make sure if we need to V-cut between these board with easy to separate the board to small board after diver.GF Suggestion：

1、No need to separate the board to small board , no need to V-cut between these small board, just deliver as a big board, please confirm kindly.2、Please give us your advice.（8）此位臵V-CUT超能力 Question description：You required us to jump V-cut, but there are no enough space.See fig below.GF Suggestion： Please confirm kindly（9）金手指增加镀金引线

Question description：In Gerber file ―017-065c.dxf‖ layer Gold finger plating bar is different from you file‖ urchaseOrder-05-02-15-GloryFaith-170-00065-003-NXN05-170.pdf‖ them is conflicting, see fig below.GF Suggestion：In order to facilitate in production, we will follow file: *.pdf‖ to add Gold finger plating bar, If reject, we cannot do plating gold finger.Please confirm kindly.（10）镀金引线残留

Question description：If question(1)accepted, you required ―up to 0.1mm residual bar), but in Gerber file Gold finger to outline is 75mil distance on bottom side, and we calculate the depth of bevelling edge as 55 mil per the bevelling detail we received, if we follow master Gerber and bevelling detail to build, 0.64mm(max.)Gold plating bar on bottom side will be residual after beveling.GF Suggestion：

1、We will increase the length of the gold finger on both sides so that no residual plating bar after beveling on both side ,but the copper will be exposed on both sides ,please accept this case.2、We will follow master Gerber and the beveling detail we received to build ,and accept 0.64mm(max.)Residual gold plating bar.Question description：In Gerber file the distance from Gold finger to outline is 2.33mm on both side, if we follow master Gerber and bevelling detail to build, gold plating bar on both side will be residual after bevelling.GF Suggestion：We will follow master Gerber and the beveling detail we received to build, and residual bar is allowed, please confirm kindly.（11）金手指角度询问

Question description：You told us the bevelling angle, but you didn‘t tell us the bevelling depth.GF Suggestion: We will control the beveling depth as 1.0+/-0.15mm, please confirm kindly.See fig below.（12）外形公差太紧

Question description：In file ―FAB‖，you required about the outline tolerance , it is too tight for us to control.See fig below.GF Suggestion：Please relax the outline tolerance from 3mil to 6mil.please confirm kindly.（13）手指离TAB位太近，建议铣入TAB位

Question description： In the Gerber file, the gap between some finger and TAB is too small(only 2.74mm), it will cause that we will bevel the tab, see fig below.GF Suggestion： We will follow the Gerber to build, and allow bevel though the tab.（14）外形尺寸不符合

Question description：We found some dimensions marked in drawing are not matched with that measured the outline in Gerber file.GF Suggestion：We will follow the dimensions marked in drawing, please kindly confirm.（15）外形公差超出我们能力

Question description：In the note 7 of fab layer ―dd0124.pho‖, the tolerance +/-0.002inch for the ―X.Y cord‘s and accompanying cutout‖ is tight for us to control.(See fig01.jpg)GF Suggestion：Please kindly relax to +/-0.004inch.（16）咨询长方形的长SLOT是否需要锣出

Question description：You haven‘t supplied the information about the rectangle frame in drill drawing(size 4.051‖x0.464‖), we can‘t make if we need to cut out this rectangle frame.(See fig below)GF Suggestion：We will cut out this area by routing, please confirm kindly.（17）单元内，槽尺寸不符合

Question description: the NPTH slot size we measured from the Gerber data(100*209.5)mismatch with the shown(100*200).(See fig02.jpg)GF Suggestion：1.Ignore the shown dimension and follow cad 1:1 to build.Please confirm.2.Follow the shown dimension(100*200)build the two NPTH slot.（18）外形槽尺寸不符合

Question description: the key slot size we measured mismatch with the shown.(See fig01.jpg)GF Suggestion：1.Ignore the shown dimension and follow the Gerber data to do.Please confirm。2.follow the shown dimension(62*250)to build.（19）V-CUT超出能力，经典

Question description: the v-score angle, remain thickness and width are all shown in the drawing file.But we cannot control the three requirements at the same time.(See fig03.jpg)GF Suggestion： We would control the v-score angle as 30+/-5degree, remain thickness as 0.010+0.08/-0inch, and just make the gap width 0.012inch for reference.Please confirm.（20）外形离PAD、孔太近，允许铣后破孔露铜

Question description: there is no gap between the key slot edge to the copper area.After routed, the copper pad would be exposed and the hole might leads to broken-out.(See fig06.jpg)GF Suggestion： Follow cad and the copper pad exposed and the hole broken-out is acceptable.（21）铣槽与PAD无间距。刮铜6mil Question description：There is no gap between the circuit pad and the routing out rectangle area on the topside circuit layer.(see fig01.jpg)GF Suggestion：1.follow cad and the copper exposed after routing is acceptable.2.shave the circuit pad about 6mil to avoid the copper exposed.（22）无表面处理

Question description： The surface treatment is not shown.GF Suggestion： 1.the surface treatment: HASL(hot air solder level).2.pls give other advice.（23）V-CUT后，允许破孔露铜

Question description： There is no gap for the hole edge to the board profile.After v-cut, the hole would be broken and the copper pad would also be exposed.(See fig03.jpg)GF Suggestion: follow the Gerber design, the hole broken and the copper pad exposed is acceptable.（24）V-CUT超过能力

Question description：Remain thickness tolerance ‗+/-3mil‘ and the maximum no registration ‗+/-3mil‘for the v-cut are tight for us to control.(See fig04.jpg)GF Suggestion: Please kindly relax remain thickness tolerance to +/-4mil and the maximum no registration to +/-5mil.（25）客户没有说是否V-CUT Question description：The set boards have 4 units, but customer didn‘t point how to separate the unit.GF Suggestion：We suggest to separate the board by V-CUT(see fig03)and control as below: Angle: 30+/-5°，remaining thickness: 0.4+/-0.1mm.（26）线路离外形边太近，移动线路

Question description： On bottom side, there are one trace which is overlap the outline, when profile outline, it will damage this trace(see fig05).GF Suggestion：We suggest shifting this trace into the board so as to keep enough spacing between the outline and the trace.（27）铜面与板边无间隙，露铜是可接受的，不刮铜

Question description: no gap between the copper area and the board profile, after routed the copper would be exposed.(See fig02.jpg)GF Suggestion： Follow cad and the copper exposed after routing is acceptable.Please confirm.（28）经典4废1 Question description: for one panel includes 4 physical units, to smooth the mass production, please accept that 1-X out(max)per panel.GF Suggestion： Please confirm.（29）经典9废1 Question description： Panel shipment 1 panel=9 units.In production some of them maybe scraped, so we suggest that 1 unit X-OUT per panel is acceptable.GF Suggestion： Please confirm.（30）完成板尺寸太小，拼版制作

Question description: Because the size of unit is too small(only: 54x54mm), go against mass product.GF Suggestion：We will accord to the size of unit to build panel drawing(Detail panel drawing see page two, add tooling hole and fiducially mark)Question description：This board is too small to be fabricated, so we will make them in panel.Meanwhile, we want to add three Φ2.0mm tooling holes.Please see attached panel drawing in fig1.GF Suggestion：Please kindly confirm.（31）V-CUT离线太近，移线至16mil，以免露铜

Question description: The gap between the v-cut line and the near circuit pattern is only about 4.0mil, after v-cut, the copper line would be damaged.GF Suggestion：： Move these lines away from v-cut about 16mil to avoid the copper line damaged and exposed.（32）需要客户确认外形

Question description： Please confirm profiles drawing.GF Suggestion： Please confirm.（33）我司做的拼版外形图要客户确认

Question description： Attached ―Panel drawing.jpg‖ is the panel drawing with rails.GF Suggestion： Please confirm it being ok or not.（34）倒边金手指时，一同倒TAB边

Question description：The tab is too close to Gold finger tab, the tab will be beveled when beveling gold finger tab, see attached picture.GF Suggestion：Allow bevel the tab together with gold finger tab.（35）表面处理（客户有ROHS要求，但PO注明为HASL）

Question description：Customer had Rosh requirement, but the surface treatment of HASL can‘t meet the requirement of Rosh in our process, so we would like to use immersion gold for this board but not HASL as requested in customer P/O.GF Suggestion： Please kindly confirm.Question description: You required us the finished treatment as immersion tin in the file of ―P840 read me.txt ―, but it is unmatched with ‖tin lead plate hot air level‖ in the file ―spec.gbr‖, we are not sure which treatment we should to build.GF Suggestion: We will ignore this difference and to build this board as the treatment of the immersion tin, please kindly confirm.（36）ROUT公差

Question description: See the figure below, we did not found the file “P1291AMIL.MIL” and the rout tolerance is tight for us to control.GF Suggestion: We will ignore the file“P1291AMIL.MIL” and only to according the file “rout-path.gbr”, we will control the rout tolerance as +/-0.2mm that you marked in the file ―P840 read me.txt‖

（37）V-CUT Question description: See the figure below, we found you supplied us the integrated rout-path, but we found you designed two v-score in the Gerber at the same time, we think it is not need to v-score, and it may cause burr on the board edge if v-score.GF Suggestion: We will cancel these two v-score, please kindly confirm.（38）铜近OUTLINE Question description: See the figure below, we found some pad and copper is so clear to the outline, it may cause copper and pad exposed after routed.GF Suggestion: 1.We will shave the pad and the copper to get 0.25mm away form the outline and avoid copper or pad exposed.2.We will follow the Gerber to build and copper or pad exposed at the board edge is allowed。

（39）外形不在一条直线上

Question description：We measured at different points of outline in GERBER, but the dimensions were not same, so we will take the outline that base on the GERBER, see ―2008485A0.pdf‖.GF Suggestion：Please kindly confirm.（41）铜皮延伸至板外，导致板边露铜

Question description：Some copper is extended the outline, it will cause copper exposed at the board edge.GF Suggestion：We will shave copper to get 16mil clearance away from the outline to avoid copper exposed at the board edge.Question description：Some pad is extended the outline, see fig below, it will cause copper exposed at the board edges.GF Suggestion：

1、We will shave pad to get 10mil clearance to avoid copper exposed at the board edge.2、We will follow Gerber to build, copper exposed at the board edge is allowed.（42）线路离外围太近

Question description： The gap between the outline and the adjacent circuit line is only 1.5mil, after routing.The line would be damaged.See fig below.GF Suggestion:

1、follow Gerber design, and the circuit line damaged after routing is acceptable.2、We will move this circuit(3mil)inside the board, and reduce the circuit size to 18mil to avoid copper exposed, please confirm kindly.3、We will shave copper to get 0.25mm clearance away from the outline to avoid copper exposed.Question description：Some copper is extend of the outline, see fig below, it will cause copper exposed at the board edge GF Suggestion：

1、We will follow Gerber to build, copper exposed at the board edge is allowed.2、We will shave the copper to avoid copper exposed at the board edge.（43）单元报废的询问

Question description：Panel shipment 1 panel=18 units.In production some of them maybe scraped, so we suggest that 3 unit X-OUT per panel is acceptable。

GF Suggestion：Please confirm kindly.（44）无OUTLINE Question description：No board outline in the Gerber file.GF Suggestion： Please provide fab.Drawing or board outline to us.（45）内角 Question description: In the panel drawing, some inside corners are right angle, it is impossible to make according to our process.GF Suggestion：We will control inside corner as R1.0mm(MAX).

第二篇：有关PCB(总结)

PCB ：Printed circuit board 印刷电路板

介电层（基材）：Dielectric 用来保持线路与各层之间的绝缘性，俗称为基材。基材的分类：

由底到高的档次划分： 94HB-94V0-22F-(CEM-1)-(CEM-3)-(FR-4)94HB:普通纸板，不防火。（最底档的材料，不能做电源板。模冲孔。）

94V0:阻燃纸板。（模冲孔）22F : 单面半玻纤板。（模冲孔）

CEM-1:单面玻纤板。（电脑钻孔，不能模冲孔。）CEM-3:双面半玻纤板。FR-4:双面玻纤板。

由阻燃等级划分：(94V-0)-(94V-1)-(94V-2)-94HB TG:玻璃转化温度即熔点。PCB板必须耐燃，在一定温度下不能燃烧，只能软化。这时的温度点即是玻璃转化温度。

板材的国家标准：GB/T4721-4722 1992、GB/T4723-4725 1992

板材的TG等级：TG大于等于130度、TG大于等于150度、TG大于等于170度。TG大于等于170度，叫做高TG印刷板。

防焊油墨：Solder Mask / Solder Resistant 并非所有的铜面都要吃锡上元件，因此非吃锡的区域，会印上一层隔绝铜面吃锡的物质（通常为环氧树脂），被免非吃锡间的线路短路。按不同的工艺：有绿油、红油、蓝油。

表面处理：Surface Finish 由于铜面在一般环境中，很容易氧化导致无法上锡，因此会在吃锡的铜面上进行保护。保护的方式有喷锡（HASL）、化金（EING）、化银（Immersion Silver）、化锡（Immersion Tin）、有机保焊剂（OSP）。

PCB板材的分类 按板材的刚柔程度分类可分为刚性覆铜箔板和挠性覆铜箔板两大类 按增强材料的不同分类可分为纸基、玻璃布基、复合基（CEM系列）和特别材料基（陶瓷、金属基）。

纸基板

酚醛纸基板俗称纸板、胶板、VO板、阻燃板、红字覆铜板、94V0、电视板、彩电板等。其中有多个牌子：建滔（KB字符）、长春（L字符）、斗山（DS字符）、长兴（EC字符）、日立（H字符）。

酚醛纸基板是以酚醛树脂为粘合剂，以木桨纤维纸为增强材料的绝缘层压材料。酚醛纸基板一般可进行模冲加工，成本低价格便宜，相对密度小的优点。酚醛纸基板的工作温度较低，耐湿性和耐热性与环氧玻纤布基板相比略低。纸基板是以单面覆铜板为主，但也出现了用银桨贯通孔的双面覆铜板产品。牌子有斗山（DS字符）。它在耐银离子迁移方面，比一般的酚醛纸基覆铜板有所提高，酚醛纸基覆铜纸板最常用的产品型号为FR-1（阻燃型）和XPC（非阻燃型）两种。单面覆铜纸板从板材后面的字符颜色可以轻易判断，一般红字为FR-1（阻燃型），蓝字为XPC（非阻燃型）。

环氧玻纤布基板

环氧玻纤布基板俗称环氧板、环纤板、纤维板、FR4。

环氧玻纤布基板是以环氧树脂作为粘合剂，以电子级玻璃纤维布作为增强材料的一类基板。它的粘合结片和内芯薄型覆铜板，是制作多层印刷电路板的重要基材。工作温度较高，本身性能受环境影响小。在加工工艺上，要比其它树脂的玻璃布基板具有很大的优越性。其中的牌子如生益科技。

复合基板（CEM）

复合基板俗称粉板、22F。主要是指CEM-1和CEM-3复合基覆铜板。

复合基板CEM-1是以木桨纤维纸或棉桨纤维纸作为芯材增强材料，以玻璃纤维布作为表层增强材料，两层都浸以阻燃环氧树脂制成的覆铜板，称为CEM-1。

复合基板CEM-3是以玻璃纤维纸作为芯材增强材料，以玻璃纤维布作表层增强材料，都浸以阻燃环氧树脂制成的覆铜板，称为CEM-3。

阻燃等级：

HB：UL94和CSAC22.No0.17标准中最低的阻燃等级，要求对3到13毫米厚的样品，燃烧速度小于40毫米每分钟；小于3毫米的样品，燃烧速度小于70毫米每分钟或者在100毫米的标志前熄灭。

V-0：对样品进行两次的10秒燃烧测试后，火焰在30秒内熄灭。不能有燃烧物掉下。V-1：对样品进行两次的10秒燃烧测试后，火焰在60秒内熄灭。不能有燃烧物掉下。V-2：对样品进行两次的10秒燃烧测试后，火焰在60秒内熄灭。可以有燃烧物掉下。

PCB板板材厚度，按国家标准来分有: 0.5mm/0.7mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm/2.4mm/3.2mm/6.4mm PCB上的铜箔厚度，按国家标准来分有： 18um/25um/35um/70um/105um 对铜箔的要求金属纯度不低于99.8%，厚度误差不大于5um.

第三篇：PCB实习总结

单双面板PCB（Printed circuit Board）工艺制程

一、双面覆铜板工艺流程

双面刚性印制板 — 双面覆铜板 — 开料 — 钻基准孔 — 数控钻导通孔— 检验 — 去毛刺刷洗 — 化学镀铜（导通孔金属化）— 全板电镀薄铜 —检验刷洗 — 网印负性电路图形— 固化 — 干膜或湿膜 — 曝光 —显影检验—修板—线路图形电镀— 电镀锡 — 抗蚀镍/金 — 去印料 —感光膜— 蚀刻铜 — 退锡 — 清洁刷洗网印阻焊图形常用热固化绿油 — 贴感光干膜或湿膜 — 曝光 — 显影 — 热固化 — 常用感光热固化绿油 — 清洗 —干燥 — 网印标记字符图形 — 固化 —喷锡或有机保焊膜 — 外形加工 — 清洗 — 干燥—电气通断检测—检验包装 — 成品出厂。

二、流程详解

1、来料检验：

检测铜箔厚度，板材厚度，板材尺寸，板材表面质量。

2、开料：

目的：将覆铜板剪裁成生产板加工尺寸，方便生产加工。

注意：

A.裁切方式会影响下料尺寸

B.磨边与圆角的考量-影响影像转移良率制程

C.方向要一致-即经向对经向，纬向对纬向

3、打定位孔

注意：偏位、孔内毛刺与铜屑、划伤板面。

4、数控钻导通孔

钻孔最重要两大条件就是“Feeds and Speeds”进刀速度及旋转速度：

A.进刀速度(Feeds)：每分钟钻入的深度，多以吋／分(IPM)表示。上式已为“排屑量”(Chip Load)取代，钻针之所以能刺进材料中心须要退出相同体积的钻屑才行，其表示的方法是以钻针每旋转一周后所能刺进的吋数(in/R)。当进刀速度约为120in/min左右，转速为６万RPM时，其每一转所能刺入的深度为其排屑量。排屑量高表示钻针快进快出而与孔壁接触时间短，反之排屑量低时表示钻针进出缓慢与孔壁磨擦时间增长以致孔温升高。

设定排屑量高或低随下列条件有所不同：

1.孔径大小 2.基板材料 3.层数 4.厚度

B.旋转速度(Speeds)：每分钟所旋转圈数(Revolution Per Minute RPM)。通常转数约为６万－８万RPM，转速太高时会造成积热及磨损钻针。

例如：2011/2/24日，中试板材钻孔参数设置如下：进刀速度：3.0m/min，退刀速度:10m/min，旋转速度：8.5万RPM。钻针直径：0.5mm。

钻孔作业中会使用的物料有钻针(Drill Bit)。垫板(Back-up board)。盖板(Entry board)等。注意事项：

钻针：成份94%是碳化钨,，6%左右是钴，耐磨性和硬度是钻针评估的重点。其合金粒子愈细能提高硬度以及适合钻小孔。通常其合金粒子小于1微米（micron）。

垫板：垫板的功用有：a.保护钻机之台面，b.防止出口性毛头(Exit Burr）c.降低钻针温度。

d.清洁钻针沟槽中之胶渣。

盖板：盖板的功用有：a.定位 b.散热 c.减少毛头 d.钻头的清扫 e.防止压力脚直接压伤铜面

5、化学镀铜

目的：使孔壁上之非导体部份之树脂及玻纤束进行金属化(metalization)，以进行后来之电镀铜制程,完成足够导电及焊接之金属孔壁。

原理：通过前面的去毛刺刷洗，将孔内的钻孔钻污去除，使孔内清洁，后通过活化在表面与孔内吸附胶体钯，在沉铜缸内发生氧化还原反应，行成铜层附于板面。

工序：上板----碱性除油----水洗----水洗----微蚀----水洗----水洗----预浸----活化----水洗----纯水洗----还原----水洗----纯水洗----沉铜----水洗----水洗----下板。

注意事项：凹蚀过度，孔露基材，板面划伤。

6、全板电镀

目的：对刚沉铜出来的板进行板面、孔内铜加厚到5-8μm，保证在后面的加工过程中不被咬蚀掉。

原理：通过浸酸清洁板面，在镀铜缸，阳极铜溶解出铜离子在电场的作用下移动到阴极得到电子还原出铜附在板面上，起到加厚铜的作用。

注意：保证铜厚，镀铜均匀，防止板面划伤。

7、图形转移

目的：把感光油墨印刷在印制板上，通过光合、化学反应把需要的图形转移到线路板上面。原理：利用干膜的特点，在一定温度与压力作用下膜贴于板面上通过对位曝光，干膜发生反应，形成线路图形。

工序：来料----磨板----湿膜丝印----烘烤----对位----曝光----显影----出板。

注意：板面清洁、防止对偏位、底板划伤、曝光余胶、显影余胶、板面划伤。

8、线路图形电镀

目的：使线路、孔内铜厚加厚到客户需要标准。

原理：通过前处理，使板面清洁，在镀铜、镀锡缸阳极溶解出铜离子、锡离子，在电场作用下移动到阴极，得到电子，形成铜层、锡层。

工序：来料----除油----微蚀----预浸----镀铜----浸酸----镀锡。

注意：镀铜、镀锡厚度和均匀性。防止掉锡、手印、撞伤板面。

9、蚀刻

目的：将板面没有用的铜蚀刻掉，形成有用的线路图形。

工序：去膜----蚀刻----退锡（水金板不退锡）

原理：在碱液的作用下，将膜去掉露初待蚀刻的铜面，在蚀刻缸铜与铜离子发生反应，生产

亚铜，达到蚀刻作用，在退锡缸内硝酸与锡面发生反应，去掉镀锡层，露出线路、焊盘、铜面。

注意：防止退膜不尽，蚀刻不尽，过蚀，线变宽，退锡不尽、板面撞伤。

10、蚀检

目的：利用目视检查的方法，对照线路图形找出与板面要求不相符的部分。

11、阻焊

目的：在板面涂上一层阻焊，通过曝光显影，露出要焊接的盘与孔，其它地方盖上阻焊层，起到防止焊接短路的作用。

原理：用丝印网将阻焊泥漏印于板面，通过预烘去除挥发，行程膜层，通过对位曝光，被光照的地方阻焊膜交联反应，没照的地方在碱液的作用下显影掉。在高温下，阻焊完全固化，附于板面。

工序：阻焊前处理----阻焊印刷----阻焊预烤----阻焊显影----阻焊曝光----阻焊固化。注意：阻焊杂物，对位偏，阻焊上焊盘，阻焊胶，划伤。

12、网印文字

目的：利用传统的丝网印刷方式，将客户所需要的文字符号准确的印到对应的位置。工序：文字丝印----文字烘烤

注意：字符模糊，不清。

13、热风整平（喷锡）

目的：在裸露的铜面上涂盖一层锡，达到保护铜面不氧化，利于焊接作用。

原理：通过前处理，清洁铜面的氧化，在铜面上涂一层助焊剂，后在锡炉中锡条与铜反应生成锡铅铜（或锡铜）合金起到保护铜面利于焊接的作用。

工序：前处理----喷锡----后处理----检查

注意：孔露铜，焊盘露铜，手指上锡，锡面粗糙，锡面过高。

14、外形

目的：加工成客户要求的尺寸大小。

成型工艺：冲板，铣板，V-割。

注意：防止放反板，撞伤板，划伤。

15、电测试

目的：模拟板的状态，通电进行电性能检查，是否有开、短路。

注意：漏测，测试机压伤板面。

16、终检

目的：对板得外观、尺寸、孔径、板厚、标记等检查，满足客户要求。

注意：漏检，撞伤板面。

17、包装

目的：板包装成捆，入库。

注意：撞伤板，混板。

第四篇：PCB设计总结

设计总结

通过本次设计，我体会到整个设计的流程是从规则设置-----元件布局------过孔扇出与布线-----铺铜的处理-----走线优化------验证设计----处理丝印与出GERBER。

在该设计过程中，我出现了很多问题，现归纳如下：

1，对布局的思考太死板，没考虑到对后面走线的影响。2，走线不够通顺，不能很好的结合原理图来走线。3，哪些地方该铺铜，哪些地方不应铺铜比较模糊。4，软件设置不够熟悉。

由此总结几点要点。

一，关于过孔与铺铜的总结：

1，过孔尽量打到栅格点上，且保持对齐。

2，大电源部分要多打过孔，对于电感的处理，变压器的处理要注意。

铺铜不要超过焊盘下边缘。

3，铜箔宽度不要太大，5.5~6.5mil,不能小于4.5，不要用整数、4，铜箔宽度尽量保持一致。

5，电源层大电源铜箔挖出一块区域作为小电源铜箔，可以通过设置其优先级，来达到铺铜效果。不同电源铜箔间距一致，一般25mil适宜。倒角一般采用45°。二，关于走线的总结：

1，走线不能出现任意角度，一般保持45°角。

2，两个串联电容中间走线要加粗。走线间距保持3倍线宽较宜。

3，电源引脚对应的耦合电容要直连，保持电源电路通顺。

4，对于FPGA以及数据收发IC的IO口可以通过交换引脚是走线通顺。交换时保持数据口对应关系。5，模拟电路与数字电路走线要区分开，防止干扰产生。对应运放电路走线要加粗。6，大电源走线采用星形走线。可通过电源层走线。7，测试点要连入相应的网络。走线保持同组同层。

8，接插件中间尽量不走线。出线保持间距一致，走完的线可以通过锁定防止误操作，做到美观统一。

第五篇：PCB工艺总结

PCB工艺总结：

第一章、原材料

1、基板：一般印制电路板用基板材料可分为两大类：刚性基板材料和柔性基板材料。一般刚性基板材料的重要品种是覆铜板。它是用增强材料(包括玻纤布基覆铜板；纸基覆铜板；复合基覆铜板，另外还有特殊增强材料构成的覆铜板还有：芳酰胺纤维无纺布基覆铜板、合成纤维基覆铜板等)，浸以树脂胶黏剂（即绝缘材料，酚醛树脂、环氧树脂(EP)、聚酰亚胺树脂(PI)、聚酯树脂(PET)、聚苯醚树脂(PPO或)、氰酸酯树脂(CE)、聚四氟乙烯树脂(PTFE)、双马来酰亚胺三嗪树脂(BT)），通过烘干、裁剪、叠合成坯料，然后覆上铜箔，用钢板作为模具，在热压机中经高温高压成形加工而制成的。一般的多层板用的半固化片，则是覆铜板在制作过程中的半成品(多为玻璃布浸以树脂，经干燥加工而成)。

2、铜箔：覆铜板的铜箔在出厂前需要进行表面处理。（有电镀铜箔和碾压铜箔，后者主要用在挠性产品中。）A 传统处理

a、瘤化处理：在粗面迅速镀一层铜 b、是否镀锌、镀镍处理 c、是否进行钝化处理

3、防焊漆：主要作用是留出板上等焊的通孔及PAD(锡垫),将其它的线路及铜面盖住，防止波焊时造成短路；防止湿气及各种电解质侵害线路、防止外来的机械伤害；绝缘功能。

防焊油漆颜色有绿、黄、白、黑。种类主要有环氧树脂IR烘烤型、UV硬化型、液态感光型，干膜防焊漆。

环氧树脂IR烘烤型：

UV硬化型：

液态感光型：液态感光双组份防焊油墨吧，其主要成份是：树脂，色粉，铜面促进剂，消泡剂，稳定剂等

干膜防焊漆：

4、油墨：

第二章 生产工工艺

一、内层制作工艺

1、裁板、磨边：将一张大料根据不同拼板要求用机器切成小料的过程。开料后的板边尖锐，容易划伤手，同时使板与板之间擦花，所以开料后再用磨边机磨边。

2、铜面处理：在印刷电路板制程中不管那一个步骤，铜面的清洁与粗化的效果关系着下一工序的成败。以下工序需要进行铜面处理： a.干膜压膜；b.内层氧化处理前； c.钻孔后；d.化学铜前；e.镀铜前；

f.绿漆前；g.喷锡(或其它焊垫处理流程)前；h.金手指镀镍前

除a.c.f.g.外，其余工序的铜面处理皆属制程自动化中的一部分。（1）铜面处理工艺（a.刷磨法、b.喷砂法、c.化学法）1刷磨法：需要做刷良试验，确定刷深及均匀性。○

a、优点： 成本低、制程简单弹性；

b、缺点： 薄板细线路板不易进行、基材拉长不适内层薄板、刷痕深时易造成D/F附着不易而渗镀、有残胶之潜在可能

c、工艺流程：利用刷磨均匀抛刷铜面其平整且刷痕一致，获得均匀的粗糙度，对油墨有良好的附著力。刷磨轮分三种： 尼龙刷磨；白毛清洗刷磨（无研磨剂）、不织布刷磨轮；

2.喷砂法：喷砂材料由70%矿物化火山岩组成，去除氧化物，粗糙铜面。○3 化学微蚀法（发展趋势，因为产品向着超薄方向发展）：只针对内层薄片○（厚度小于8mil）使用。有时与刷磨工序联合使用。主要微蚀液为sps(过硫酸钠)+硫酸，过硫酸铵+硫酸体系;双氧水+硫酸体系.微蚀速度40～60u/s.3、图像转移

（1）印刷法（将逐步被干膜法替代）：下列是目前尚可以印刷法cover的制程: a.单面板之线路,防焊(大量产多使用自动印刷,以下同)b.单面板之碳墨或银胶 c.双面板之线路,防焊 d.湿膜印刷 e.内层大铜面 f.文字

g.可剥胶(Peelable ink)（2）丝网印刷：

丝网印刷中几个重要基本原素:网材,网版,乳剂,曝光机,印刷机,刮刀,油墨,烤箱等,.a.网布材料

(1)依材质不同可分丝绢(silk),尼龙(nylon),聚酯(Polyester,或称特多龙),不锈钢,等.电路板常用者为后三者.(2)编织法:最常用也最好用的是单丝平织法 Plain Weave.b.网版(Stencil)的种类

(1).直接网版(Direct Stencil)将感光乳胶调配均匀直接涂布在网布上烘干后连框共同放置在曝光设备台 面上并覆以原稿底片再抽真空使其密接感光经显像后即成为可印刷的网 版通常乳胶涂布多少次,视印刷厚度而定.此法网版耐用,安定性高,用于大 量生产.但制作慢,且太厚时可能因厚薄不均而产生解像不良.(2).间接网版(Indirect Stencil)把感光版膜以曝光及显像方式自原始底片上把图形转移过来然后把已有图 形的版膜贴在网面上待冷风干燥后撕去透明之载体护膜即成间接性网版 其厚度均匀,分辨率好,制作快,多用于样品及小量产.c.油墨

油墨的分类有几种方式(1).以组成份可分单液及双液型.(2).以烘烤方式可分蒸发干燥型化学反应型及紫外线硬化型(UV)(3).以用途可分抗蚀,抗镀,防焊,文字,导电,及塞孔油墨.不同制程选用何种油墨,须视各厂相关制程种类来评估,如碱性蚀刻和酸性蚀刻 选择之抗蚀油墨考虑方向就不一样.d、烘烤

不同制程会选择不同油墨, 烘烤条件也完全不一样,须根据厂商提供的 data sheet,再依厂内制程条件的差异而加以修改.一般因油墨组成不一 烘烤方式有风干,UV,IR等烤箱须注意换气循环温控时控等.3、干膜法：

4、蚀刻：用于蚀刻的化学药液种类常见者有两种：一是酸性氯化铜(CuCl2)蚀刻液，一种是碱性氨水蚀刻液，主要配方见下图：

酸性蚀刻液中CU2+浓度控制：

a.CuCl2酸性蚀刻反应过程之分析

铜可以三种氧化状态存在原子形成Cu°, 蓝色离子的Cu++以及较不常见 的亚铜离子Cu+金属铜可在铜溶液中被氧化而溶解见下面反应式1 Cu°+Cu++2 Cu+-------------(1)在酸性蚀刻的再生系统就是将Cu+氧化成Cu++,因此使蚀刻液能将更多的 金属铜咬蚀掉

以下是更详细的反应机构的说明 b.反应机理及过程

直觉的联想在氯化铜酸性蚀刻液中Cu++ 及Cu+应是以CuCl2 及CuCl存 在才对但事实非完全正确两者事实上是以和HCl形成的一庞大错化物存 在的

Cu° + H2CuCl4 + 2HCl 2H2CuCl3-------------(2)金属铜 铜离子 亚铜离子

其中H2CuCl4 实际是 CuCl2 + 2HCl 2H2CuCl3 实际是 CuCl + 2HCl 在反应式(2)中可知HCl是消耗品即使(2)式已有些复杂但它仍是以下两 个反应式的简式而已

Cu°+ H2CuCl4 2H2CuCl3 + CuCl(不溶)----------(3)CuCl + 2HCl 2H2CuCl3(可溶)----------(4)式中因产生CuCl沈淀会阻止蚀刻反应继续发生但因HCl的存在溶解 CuCl维持了蚀刻的进行由此可看出HCl是氯化铜蚀刻中的消耗品而且 是蚀刻速度控制的重要化学品。

1)蚀刻机理：

Cu+CuCl2→Cu2Cl2 Cu2Cl2+4Cl-→2(CuCl3)2-

2)影响蚀刻速率的因素：影响蚀刻速率的主要因素是溶液中Cl-、Cu+、Cu2+的含量及蚀刻液的温度等。a、Cl-含量的影响：溶液中氯离子浓度与蚀刻速率有着密切的关系，当盐酸浓度升高时，蚀刻时间减少。在含有6N的HCl溶液中蚀刻时间至少是在水溶液里的1/3，并且能够提高溶铜量。但是，盐酸浓度不可超过6N，高于6N盐酸的挥发量大且对设备腐蚀，并且随着酸浓度的增加，氯化铜的溶解度迅速降低。添加Cl-可以提高蚀刻速率的原因是：在氯化铜溶液中发生铜的蚀刻反应时，生成的Cu2Cl2不易溶于水，则在铜的表面形成一层氯化亚铜膜，这种膜能够阻止反应的进一步进行。过量的Cl-能与Cu2Cl2络合形成可溶性的络离子(CuCl3)2-，从铜表面上溶解下来，从而提高了蚀刻速率。b、Cu+含量的影响：根据蚀刻反应机理，随着铜的蚀刻就会形成一价铜离子。较微量的Cu+就会显著的降低蚀刻速率。所以在蚀刻操作中要保持Cu+的含量在一个低的范围内。c、Cu2+含量的影响：溶液中的Cu2+含量对蚀刻速率有一定的影响。一般情况下，溶液中Cu2+浓度低于2mol/L时，蚀刻速率较低；在2mol/L时速率较高。随着蚀刻反应的不断进行，蚀刻液中铜的含量会逐渐增加。当铜含量增加到一定浓度时，蚀刻速率就会下降。为了保持蚀刻液具有恒定的蚀刻速率，必须把溶液中的含铜量控制在一定的范围内。d、温度对蚀刻速率的影响：随着温度的升高，蚀刻速率加快，但是温度也不宜过高，一般控制在45~55℃范围内。温度太高会引起HCl过多地挥发，造成溶液组分比例失调。另外，如果蚀刻液温度过高，某些抗蚀层会被损坏。

5、剥膜：剥膜在pcb制程中有两个工序会使用：一是内层线路蚀刻后之D/F剥除，二 是外层线路蚀刻前（剥除(若外层制作为负片制程)）。化学药液多为NaOH或KOH浓 度在1~3%重量比。内层之剥膜后有加 酸洗中和也有防铜面氧化而做氧化处理者。

6、AOX检测：内层板线路成完后,必须保证通路及绝缘的完整性(integrity),即如同单面板一样先要仔细检查因一旦完成压合后,不幸仍有缺陷时,则已为时太晚,对于高层次板子而言更是必须先逐一保证其各层品质之良好,始能进行压合, 由于高层板渐多,内层板的负担加重,且线路愈来愈细,万一有漏失将会造成压合后的昂贵损失.传统目视外,自动光学检查(AOI)之使用在大厂中已非常普遍, 利用计算机将原图案牢记,再配合特殊波长光线的扫瞄,而快速完美对各层板详作检查但AOI有其极限,例如细断路及漏电(Leakage)很难找出,故各厂渐增加短断路电性测试。

7、压合：

（1）表面氧化处理：

A.增加与树脂接触的表面积,加强二者之间的附着力(Adhesion).B.增加铜面对流动树脂之润湿性,使树脂能流入各死角而在硬化后有更强的抓地力

C.在裸铜表面产生一层致密的钝化层(Passivation)以阻绝高温下液态树脂中胺类(Amine)对铜面的影响

主要有黑化与棕化工艺：

黑化：黑化工艺：它是一种氧化处理在碱性介质中的一种化学反应，使得树脂与铜面的接触面积增大，结合力加强。在化学反应中通常使用强氧化剂亚氯酸钠（NaclO2）、高锰酸钾（K2MnO4)等,以NaclO2化学反应为例： 4Cu+NaCLO2------2Cu2O+NaCL 2Cu2O+NaCLO2------4CuO+NaCL 黑氧化处理的产物主要是氧化铜(CuO)，黑化层因液中存有高碱度而杂有Cu2O,此物容易形成长针状或羽毛状结晶。此种亚铜在高温下容易折断而大大影响铜与树脂间的附着力, 并随流胶而使黑点流散在板中形成电性问题,而且也容易出现水份而形成高热后局部的分层爆板。黑化因结晶较长，厚度较厚，一般铜面的瑕疵较容易盖过去而能得到色泽均匀的外表。但光面的黑化层却容易受酸液之侧攻而现出铜之原色,有些人认为黑化的产物是氧化铜和氧化亚铜，这是业内的一些错误论调，经过分析，可以测定铜原子和氧原子之间的结合能，氧化物表面铜原子和氧原子之间的比例；

黑化同时也带来了一种缺陷，黑化层较厚,经PTH后常会发生粉红圈, 这是因 PTH中的微蚀或活化或速化液攻入黑化层而将之还原露出原铜色之故。对于粉红圈的处理又分为还原法和溶解法，其解决方法是提高黑化膜的抗酸能力，但是整个生产成本明显增高。

棕化：棕化过程是铜在一种酸性的介质中的一种化学反应，棕化处 理的产物主要是氧化亚铜（CU20），棕化层则呈碎石状瘤状结晶贴铜面,其结构紧密无疏孔,与胶片间附着力远超过黑化层,不受高温高压的影响,成为聚亚醯胺,另外氧化亚铜膜具有致密、完整、均匀提供一致性的粗糙度，为下一步有机金属转化膜提供了良好的物理结构。

棕化液的组成[3~6]：

① 硅烷类化合物，特别是易水解成膜的硅烷偶联剂，使用一种或多种，有些不易溶于水，需要使用醇类有机溶剂，辅助溶解，最佳使用浓度质量百分比1%-5%(未水解时的浓度)。加入棕化液前，令硅烷部分或完全水解。水解处理就是把硅烷与酸性水混合搅拌，或者与含醇类化合物的水混合。

② 唑、吡咯等化合物。咪唑、苯并咪唑、三唑、苯并三唑等衍生物。如1,2,3-三唑，1,2,4-三唑，3-甲基-1,2,4-三唑，羟基苯并三唑等。使用浓度：重量百分比0.1%-10%。最佳1%-3%。

③ 氧载体。如过氧化氢。有助于唑类化合物吸附于铜表面，若缺少，则唑类化合物无法吸附于铜面上。原因：很薄的一层铜被氧氧化后，铜表面很可能首先形成了铜-唑类化合物。用量：重量百分比0.1%-5%，最好1%-2%。太少则处理时间过长，太多则微蚀过度。过氧化氢在这里的作用不是微蚀形成粗糙铜，而是去除一薄层铜，有利于有机铜层的沉积，该层能有效地提高结合力。

④ 有机或无机酸。如硫酸、磷酸、硝酸，醋酸、甲基磺酸、乙醇酸、柠檬酸等。其中硫酸最好，成本低，不会增加废液处理难度。硫酸作用：一方面有利于硅烷水解，另一方面有利用去除一薄层铜。使用浓度：重量百分比1%-40%，最好5%-15%。

⑤ 锌化合物。可溶性的有机或无机锌盐。如硝酸锌、硫酸锌、磷酸锌、醋酸锌、甲烷磺酸锌。使用浓度：重量百分比0.01%-20%。最佳0.2%-2%。作用：在铜面吸附的第一层唑类化合物与后续吸附的唑类化合物之间，锌化合物参与形成配位络合物，这样可以形成足够厚的沉积层，该沉积层表现为暗棕色，适合应用于线路板制造。如果不使用锌化合物，则沉积层厚度很薄、颜色很淡，并且沉积层非常不均匀。

⑥ 过氧化氢稳定剂：苯磺酸、乙二胺四乙酸、巯基乙酸、硅酸钠。重量百分比浓度0.001%-1%，依稳定剂种类不同，选择相应浓度。

棕化工序：碱清洗→DI水洗→预浸液→棕化液→DI水洗→烘干。碱洗目的是除去铜表面的有机残渣和轻微的氧化层。预浸目的是保证铜表面的化学活泼性，使棕化变得快速和均匀，其中棕化是整个生产线的关键。

工艺条件：

① 使用PVC或聚四氟乙烯槽，采用摇摆或轻微搅拌。② 浸渍或水平喷淋。③ 处理温度为 30℃～38℃。温度低则耗时长，温度高则铜易微蚀过度，且过氧化氢会分解。④ 处理时间为30秒～75秒(水平喷淋)。

各组分的作用 ① 硫酸：帮助双氧水微蚀铜，水解含OH的有机聚合物，使其中的R基团变为H，以增强有机聚合物与铜的结合力。② 双氧水作用是蚀刻一层很薄的铜，促使有机金属层沉积在金属铜面上。过硫酸铵(钠)等也可以使用，但文献认为双氧水更好[7]。

③ 含OH的有机A：其与相同分子之间反应的同时与半固化环氧树脂聚合；同时与含N 的杂环化合物B、金属铜(含OH)形成化学键。

④ 含N的杂环化合物B：与基体铜结合外，通过A的桥键与环氧树脂结合，含N的杂环化合物分子间通过铜离子以配位键的形式连接起来，增加了棕化层的厚度和平整性。⑤ 氯离子：对板子的颜色、微蚀厚度、抗撕强度有很大影响。需要监测其浓度。⑥ 3,5-二硝基水杨酸等含硝基的有机化合物[7]，可以与金属表面反应，特别是铜和铜合金，以提供均匀的金属转化层，该层有利于和聚合物材料成键。

棕化液再生：棕化处理是一个化学蚀铜反应过程，随着棕化生产的进行，棕化液中的铜离子浓度不断上升，当铜离子超过一定限量后，棕化液便会因铜离子过多而产生棕化铜面发白、棕化铜面色泽不均等品质问题，因此，此时棕化槽液必须进行处理，使铜离子控制在一定范围内，从而保证棕化产品的品质。通常棕化过程中铜离子浓度达到一定限量后，需要不断排放棕化液，同时补充添加液以降低铜离子浓度，且保持棕化槽各有效组分含量的稳定。为了提高棕化液的利用率，可以收集排放的棕化液A，经过除铜和调整处理后作为棕化添加液B使用，即将棕化液A经过浓缩，成为铜离子含量较高的浓缩液，然后经过冷却结晶析出硫酸铜晶体，使溶液铜离子含量降低，最后通过对棕化液有效成分分析调整，得到添加液B，再添加到棕化生产过程中，达到棕化液循环使用的目的。

主要工艺流程：A.碱性清洗-也有使用酸洗.市售有多种专业的化药,能清除手指纹油脂,scum或有机物

B.酸浸-调整板面PH,若之前为酸洗,则可跳过此步骤.C.微蚀-微蚀主要目的是蚀出铜箔之柱状结晶组织(grain structure)来增加表面积,增加氧化 后对胶片的抓地力通常此一微蚀深度以50-70微英吋为宜微蚀对棕化层的颜色均匀上非 常重要, D.预浸中和-板子经彻底水洗后,在进入高温强碱之氧化处理前宜先做板面调整 ,使新鲜的铜 面生成-暗红色的预处理,并能检查到是否仍有残膜未除尽的亮点存在

E.氧化处理-市售的商品多分为两液,其一为氧化剂常含以亚氯酸钠为主,另一为氢氧化钠及添 加物,使用时按比例调配加水加温即可通常氢氧化钠在高温及搅动下容易与空气中的二氧化 碳形成碳酸钠而显现出消耗很多的情况,因碱度的降低常使棕化的颜色变浅或不均匀,宜分析 及补充其不足温度的均匀性也是影响颜色原因之一,加热器不能用石英,因高温强碱会使硅 化物溶解操作时最好让槽液能合理的流动及交换

F.还原此步骤的应用影响后面压合成败甚巨.G.抗氧化此步骤能让板子的信赖度更好,但视产品层次,不一定都有此步骤.H.后清洗及干燥-要将完成处理的板子立即浸入热水清洗,以防止残留药液在空气中干涸在板面 上而不易洗掉,经热水彻底洗净后,才真正完工（2）、叠板

胶片相态变化：胶片中的树脂为半硬化的 B-Stage 材料,在受到高温后即会软化及流动,经过一段软化而流动 的时间后,又逐渐吸收能量而发生聚合反应使得黏度增大再真正的硬化成为 C-Stage 材料。压合机种类：

a、舱压式压合机：压合机构造为密闭舱体，外舱加压、内袋抽真空受热，压合成型。各层板材所承受之热力与压力来自四面八方加压加温之惰性气体

优点: 因压力热力来自于四面八方故其成品板厚均匀流胶小可使用于高楼层

缺点: 设备构造复杂成本高且产量小

b、液压式压合机：液压式压合机构造有真空式与常压式。其各层开口之板材夹于上下两热压盘间，压力由下往上压，热力藉由上下热压盘加热传至板材。优点:a.设备构造简单成本低且产量大 b.可加装真空设备有利排气及流胶 缺点: 板边流胶量较大板厚较不均匀 C.ADARA SYSTEM Cedal 压合机 Cedal为一革命性压合机，其作动原理为在一密闭真空舱体中利用连续卷状铜箔迭板。在两端通电流,因其电阻使铜箔产生高温,加热。Prepreg用热传系数低之材质做压盘，藉由上方加压达到压合效果。因其利用夹层中之铜箔加热，所以受热均匀，内外层温差小，受压均匀。比传统式压合机省能源故其操作成本低廉。优点: a.利用上下夹层之铜板箔通电加热省能源操作成本低 b.内外层温差小受热均匀产品品质佳 c.可加装真空设备有利排气及流胶 d.Cycle time短约4Omin.e.作业空间减小很多.f.可使用于高楼层

缺点: 设备构造复杂成本高且单机产量小迭板耗时 压合机热源：

a、电加热式：于压合机各开口中之压盘内安置电加热器直接加热 优点: 设备构造简单成本低保养简易

缺点: a.电力消耗大；b.加热器易产生局部高温使温度分布不均 b、加热软水使其产生高温高压之蒸汽直接通入热压盘： 优点: 因水蒸汽之热传系数大热媒为水较便宜

缺点: a.蒸气锅炉必需专人操作设备构造复杂且易锈蚀,保养麻烦；b.高温高压操作危险性高

C.藉由耐热性油类当热媒以强制对流方式输送将热量以间接方式传至热压盘 优点: 升温速率及温度分布皆不错操作危险性较蒸汽式操作低 缺点: 设备构造复杂价格不便宜保养也不易 D.通电流式: 利用连续卷状铜箔迭板在两端通电流因其电阻使铜箔产生高温加热Prepreg用热传系数低之材质做压盘减少热流失

优点: a.升温速率快(35/min.)内外层温差小及温度分布均匀；b.省能源操作成本低廉

缺点: a.构造复杂设备成本高 叠板结构：

若压合机有十二个开口，每一开口有上下热压盘，共十三个热压盘。迭板方式以钢质载盘为底盘，放入十二张牛皮纸及一张铜箔。基板中间以一层镜面钢板一层板材的方式迭入十二层板材，上面再加一层镜面钢板及一张铜箔基板和十二张牛皮纸再盖上钢质盖板.A-1 迭板结构各夹层之目的

a.钢质载盘,盖板(Press plate): 早期为节省成本多用铝板,近年来因板子精密度的提升已渐改成硬化之钢板,供均匀传热用.b.镜面钢板(Separator plate): 因钢材钢性高, 可防止表层铜箔皱折凹陷，拆板容易。钢板使用后如因刮伤表面或流胶残留无法去除，就应加以研磨。

c.牛皮纸: 因纸质柔软透气的特性可达到缓冲受压均匀施压的效果,且可防止滑动。因热传系数低可延迟热传均匀传热之目的，在高温下操作牛皮纸逐渐失去透气的特性,使用三次后就应更换。

d.铜箔基板:其位于夹层中牛皮纸与镜面钢板之间，可防止牛皮纸碳化后污染镜面钢板或黏在上面，缓冲受压均匀施压

e.其它有脱模纸(Release sheet)及压垫(Press pad)Conformal press的运用,大半都用在 软板coverlayer压合上.压板过程中压力变化：

a.初压(吻压 Kiss pressure):每册(Book)紧密接合传热,驱赶挥发物及残余气体

b.第二段压:使胶液顺利填充并驱赶胶内气泡，同时防止一次压力过高导致的皱折及应力

c.第三段压:产生聚合反应使材料硬化而达到C-stage d.第四段压:降温段仍保持适当的压力，减少因冷却伴随而来之内应力 压板后处理： a、后烤：通常后烤条件是150,4小时以上.如果先前压合步 骤curing很完整,可不做后烤,否则反而有害(降低Tg).目的：a.让聚合更完全.b.若外表有弯翘,则可平整之.c.消除内部应力并可改善对位.B.铣靶,打靶-完成压合后板上的三个箭靶会明显的出现浮雕(Relief), 手动作业:将之置于普通的单轴钻床下用既定深度的平头铣刀铣出箭靶及去掉原贴的耐热胶 带,再置于有投影灯的单轴钻床或由下向上冲的冲床上冲出靶心的定位孔,再用此定位孔定 在钻床上即行钻孔作业注意要定时校正及重磨各使用工具, b.X-Ray透视打靶: 有单轴及双轴,双轴可自动补偿取均值,减少公差.C.剪边(CNC裁板)：-完成压合的板子其边缘都会有溢胶,必须用剪床裁掉。以便在后续制程中作业方便及避免造成人员的伤害,剪边最好沿着边缘直线内1公分处切下,切太多会造成电镀夹点的困扰,最好再用磨边机将四个角落磨圆及边缘毛头磨掉,以减少板子互相间的刮伤及对槽液的污染。或者现在很普遍直接以CNC成型机做裁边的作业。

8、钻孔

钻孔房环境设计

A.温湿度控制： 一般钻房的温度应控制在18-22℃、相对湿度≦50€‚当温湿度不符合要求，会影响钻机的性能表现。

B.干净的环境：钻房环境力求清洁。钻机清理时不可使用高压风枪吹尘，此举一方面会影响操作员健康，另一方面会影响钻机的寿命及精度。

C.地板承受之重量 D.绝缘接地的考量 E.外界振动干扰

钻孔过程使用的物料：

钻针(a.硬度高耐磨性强的碳化钨（94%b.耐冲击及硬度不错的钴（4%）、c.有机黏合剂）、盖板、垫板。

9、镀通孔：

其目的使孔壁上之非导体部份之树脂及玻纤束进行金属化(metalization), 以进行后来之电镀铜制程,完成足够导电及焊接之金属孔壁。主要包括以下几个步骤：

（1）去巴里：钻完孔后,若是钻孔条件不适当,孔边缘有1.未切断铜丝2.未切断玻纤的残留,称为burr.因其要断不断,而且粗糙,若不将之去除,可能造成通孔不良及孔小,因此钻孔后会有de-burr制程.也有de-burr是放在Desmear之后才作业.一般de-burr是用机器刷磨,且会加入超音波及高压冲洗的应用.（2）除胶渣(Desmear)A.目的: a.去胶渣

b.创造表面粗糙的微孔，增加结合力。B.Smear产生的原因: 由于钻孔时造成的高温Resin超过Tg值而形成融熔状终致产生胶渣 此胶渣生于内层铜边缘及孔壁区会造成P.I.(Poor lnterconnection)C.除胶渣的四种方法: 硫酸法(Sulferic Acid)、电浆法(Plasma)、铬酸法(Cromic Acid)、高锰酸钾法(Permanganate).a.硫酸法：必须保持高浓度但硫酸本身为脱水剂很难保持高浓度且咬蚀出的孔面光滑无微孔，并不适用。

b.电浆法：效率慢且多为批次生产，而处理后大多仍必须配合其它湿制程处理。因此除非生产特殊板大多不予采用。

c.铬酸法：咬蚀速度快，但微孔的产生并不理想，且废水不易处理又有致癌的潜在风险故渐，被淘汰

d.高锰酸钾法：因配合溶剂制程可以产生微孔同时由于还原电极的推出使槽液安定性获得较佳控制因此目前较被普遍使用。

高锰酸钾法(KMnO4 Process)简介: A.膨松剂(70度，主要成分氢氧化钠、已二醇乙醚、已二醇，5min): a.功能:软化膨松Epoxy降低 Polymer 间的键结能使KMnO4 更易咬蚀形成 Micro-rough 速 率 作 用 Concentration b.不可和KMnO4 直接混合以免产生强烈氧化还原发生火灾 c.原理解释:(1)初期溶出可降低较弱的键结，使其键结间有了明显的差异。若浸泡过长，强的链接也渐次降低，终致整块成为低链接能的表面。如果达到如此状态将无法形成不同强度结面。若浸泡过短则无法形成低键结及键结差异如此 将使KMnO4咬蚀难以形成蜂窝面，终致影响到PTH的效果。

(2)表面张力的问题: 无论大小孔，皆有可能有气泡残留。而表面力对孔内湿度也影响颇大。故 采用较高温操作有助于降低表面张力及去除气泡。至于浓度的问题，为使Drag out降低减少消耗而使用略低浓度，事实上较高浓度也可操作且速 度较快

在制程中必须先湿润孔内壁以后才能使药液进入作用。否则有空气残留后续制程更不易进入孔内其Smear将不可能去除

B.除胶剂(80度): a.使用KMnO4的原因:选KMnO4而未选NaMnO4是因为KMnO4溶解度较佳,单 价也较低

b.反应原理: 4MnO4-+ C + 4OH-=MnO4 + CO2 + 2H2O(此为主反应式)2MnO4-+ 2OH-2MnO4= + 1/2 O2 + H2O(此为高PH值时自发性分解反应)MnO4-+ H2O MnO2 + 2OH-+ 1/2 O2(此为自然反应会造成Mn+4沉淀)c.作业方式:早期采氧化添加剂的方式。目前多用电极还原的方式。操作不稳 定的问题已获解决

d.过程中其化学成份状况皆以分析得知但Mn+7为紫色, Mn+6为绿色,Mn+4 为黑色可由直观的色度来直接判断大略状态若有不正常发生则可能 是电极效率出了问题须注意

除胶剂再生：KMnO4的再生：要提高KMnO4工作液的使用效率，必须考虑将溶液中的MnO4 2-再生转变为MnO4-，目前

普遍采用的是电解再生法，再生器利用的是阴极为大面积的不锈钢柱形圆筒，阳极为钛材料，其与阴极的面积比很小，MnO4-2-在阳极表面发生的反应为MnO4-2--e→MnO4-。使用450~~550A的整流器，由于MnO4 2-不断地氧化成MnO4-，因此工作液中不需大量添加KMnO4原料，它的少量添加是为了平衡工作液的带出损耗，因而大大降低了生产成本，使用较长时间的工作液在槽底会形成沉淀，需定期清除，以保证处理效果。

MLB214D为树脂蚀刻促进剂，可提高KMnO4的树脂蚀刻能力，提高工作液的润湿性，减少孔内气泡，其为白色粉末状固体。

C.中和剂(40度):由于锰是重金属，它的存在会使钯中毒，使钯离子或原子失去活化性能。必须把Mn7+/ Mn6+/MnO2用酸中和成为Mn2+，反应机理如下：

a.NaHSO3是可用的中和之一。其原理皆类似Mn or Mn+6 or Mn+4(Neutralizer)->Mn+2(Soluable)b.为免于粉红圈，在选择Acid base必须考虑。HCl及 H2SO4系列都有。但Cl易攻击氧化层。所以用H2SO4/双氧水为Base 的酸较佳(还含有草酸钠)。

c.药液使用消耗分别以H2SO4及Neutralizer用自动控制设备来补充维护。(3)整孔：

除胶渣后孔内呈现双极现象，其中Cu呈现高电位正电，Glass fiberEpoxy呈负电，整孔使表面清洁，孔壁呈正电性，以利Pd/Sn Colloid负电离子团吸附。

采用阴离子表面活性剂和硫酸。（4）微蚀：

清除清孔后表面之所形成的薄膜和氧化物。微蚀液种类：sps(过硫酸钠)+硫酸，过硫酸铵+硫酸体系;双氧水+硫酸体系.微蚀速度40～60u/s.(5)预活化 Catalpretreatment 1.为避免微蚀形成的铜离子带入Pd/Sn槽，污染槽液。2.降低孔壁的表面张力

预浸槽与活化槽的成分基本相同，区别在于预浸槽中不含活化剂钯。酸性胶体钯预浸液成分：SnCl2 ：30g/L、HCl：30ml/L、NaCl：200g/L、脲素：50g/L(6)活化

①活化反应机理：溶液中的Sn2+ 和Pd2+ 的浓度为2：1时所得到的活化液活化性能最好，因此时Sn2+ 和Pd2+ 在溶液中反应形成不稳定的络合物，Pd 2+ + 2Sn2+ →〔PdSn2〕6+ →Pd+Sn4+ +Sn 2+在30℃时〔PdSn2〕6+ 络离子歧化反应12min，大约有90%以上的络合离子被还原成金属钯，它 们呈现出极其细小的金属颗粒分散在溶液中，当加入大量Sn2+ 的和Cl--时，这些细小的钯核表面上很快吸附大量的Sn2+ 的和Cl-，形成带负电的胶体化合物 〔Pd（SnCl3）〕-，这些胶体化合物悬浮在溶液中（负 负相斥），不会沉聚，胶体钯在酸性环境中较稳定，当表面带正电荷的印制板浸入处理液后，胶体钯会很快被基材吸附，而完成活化处理。活化处理过的印制板，在水洗时，表面的SnCl2水解形成碱式锡酸盐沉淀。

②目前市售的胶体钯活化剂大多为盐基胶体钯。PdCl2：1g/l、NaCl：250g/l、SnCl2：12。8g/l、HCl：40ml/l、Na2SnO3：2g/l脲素：50g/l。

③CAT44浓缩液是一种不易燃，酸性，深褐色的液体，每公升大约含钯4。7g，比重约1。2。

(7)速化 Accelerator

+71.Pd胶体吸附后必须去除Sn使Pd2+曝露如此才能在未来无电解铜中产生催化作用形成化学铜，实质是使碱式锡酸盐溶解，可用酸也可用碱处理，效果最好的是 1%的HBF4处理1~~2min。

2.基本化学反应为

Pd+2/Sn+2(HF)Pd+2(ad)+ Sn+2(aq)Pd+2(ad)(HCHO)Pd(s)(8)化学镀铜

镀液成分及作用：

铜盐（253A CuSO4²5H2O）、络合剂（253E EDTA 络合铜离子，减缓沉积速率），还原剂（甲醛，次磷酸盐（新的还原剂，反应机理：Cu2+ ＋ H2PO2－ ＋H2O ====Cu↓+ H2PO3＋2H＋（酸性）；Cu2+ ＋ H2PO2－ ＋2OH－ ====Cu↓+ H2PO3＋H2O（碱性）），PH值调节剂（NaOH，甲醛在强碱条件下才具有还原性，因此必须加入适量的碱。

添加剂：溶液中存在微量的Cu+，其歧化反应形成的铜粉具有催化作用，易加速化学铜溶液的分解。添加剂能络合Cu+，减小Cu+ 的干扰。

反应机理：

正常反应为 2HCHO+4OH++Cu2+→Cu+2HCOO-+H2O+H2 从反应式可看出，溶液必须为强碱性，HCHO的还原能力取决于碱性强弱，即PH值。在碱性中，必须有足够的络合剂，以稳定Cu2+不致生成 沉 淀。溶液中的相应成分必须保持相应的一定比例。同时反应必须有催化剂的催化作用。

副反应： 不管镀铜液使用与否，总是存在以下两个反应： Cu2O的生成：2Cu2+ +HCHO+5OH-→Cu2O+HCOO-+3H2O Cu2O +H2O→2Cu+ +2OH-2Cu+ →Cu2+ +Cu 形成的铜 粉是分子量级的，分散于溶液中，这些小颗粒具有催化能力，当铜粉数量较多时，就会引起沸腾式的反应，导致溶液迅速分解。HCHO与NaOH的反应：2HCHO+OH-→HCOO-+CH3OH 对于放置不用的化学铜液，几天后，因歧化反应，HCHO变成CH3OH和HCOOH，且消耗大量的NaOH，溶液PH值变低，因此放置不用的溶液重新起用时，必须重新调整HCHO和PH值，特别是HCHO含量小于3g/L时，会加速Cu2O的生成，加速铜液的分解。

目前新工艺：超声波辐射化学镀铜、激光增强化学镀、无钯化学镀（9）剥挂架

10、一次铜

非导体的孔壁经PTH金属化后立即进行电镀铜制程, 其目的是镀上200~500微英吋以保护仅有20~40微英吋厚的化学铜被后制程破坏而造成孔破(Void)。

三、外层制作

1、铜面前处理（同内层制作工序）

2、压干膜：（溶剂显像型、半水溶液显像型、碱水溶液显像型），目前流行的为碱水溶液显像型，以碳酸钠显像、用稀氢氧化钠剥膜。

一、干膜的结构和种类

(1)干膜制造印制电路的优点 分辨率高，能制造线宽0.1mm的图形，在干膜厚度范围以内都能获得边缘垂直的线条，保证线条精度；干膜的厚度和组成基本稳定，避免成像时的不连续性，可靠性高；便于掌握。应用干膜可大大简化印制板制造工序，有利于实现机械化和自动化。

(2)干膜结构 干膜由保护膜聚乙烯、光致抗蚀剂膜和载体聚酯薄膜三部分组成，三者厚度分别是25弘m，几十至100μm和25μm。

(3)干膜种类 依照干膜显影和去膜方法的不同，将干膜分成三类：溶剂型干膜、水溶性干膜和剥离型干膜。

根据干膜的用途，也将干膜分成三类：抗蚀干膜、掩孔干膜和阻焊干膜。(4)干膜的主要成分及作用

①胶黏剂 主要是使胶膜具有一定的化学、物理及机械性能，通常是酯化或酰胺化的聚苯丁树脂。胶黏剂不含感光基团，属于光惰性物质，它与组分的混溶性、成膜性、显影性和去膜性良好。

②光聚合单体 是胶膜的主要成分，在光引发剂的存在下，经紫外光照射发生聚合反应，而不溶于显影液，未感光部分被显影掉，形成抗蚀干膜图像。光聚合单体还是增塑剂，直接影响干膜的韧性、抗蚀性及贴膜性。它主要采用高沸点、易混溶的多官能团不饱和酯类，如三乙二醇双丙烯酸酯，季四醇三烯酸酯等。③光引发剂 在紫外光的照射下分解成游离基，引发聚合和交联反应的物质常用安息醚，叔丁基蒽、醌等。④增塑剂 用于增加干膜的韧性，降低贴膜温度，常用的是三缩乙二醇二乙酸酯。

⑤增黏剂 可增强干膜与铜表面之间的结合力，克服干膜固化后与铜表面之间产生应力而黏附不牢引起胶膜起皮翘起、渗镀。常用增黏剂有苯并三氮，苯并咪唑等，是氮杂环化合物，与铜表面形成配价键结构而提高黏附力。

⑥热阻聚剂 在于膜的制造、运输、贮存和使用过程中，可能发生热聚合，影响干膜的解像力和显影性能。为阻止热能引发的干膜聚合，可在于膜抗蚀剂中加入了对苯二酚，对甲氧基酚等物质。

⑦色料为使干膜抗蚀剂感光显影后形成良好的视觉反差，在干膜中加入了孔雀石绿、甲基紫、亚甲基蓝等颜料。

⑧溶剂 干膜中常用溶剂是丙酮和乙醇。

操作环境：无尘室中进行万级以上，环境温度应控制在23°±3，相对湿度应保持50RH±5左右。操作人员也要带手套及抗静电之无尘衣帽。

压膜机可分手动及自动两种,有收集聚烯类隔层的卷轮、干膜主轮、加热轮、抽风设备等四主要部份。一般压膜条件为：

压膜热轮温度 120°±10 板面温度 50±10 压膜速度 1.5~2.5米/分 压力 15-40 psi

3、曝光： 曝光机种类 手动与自动

平行光与非平行光 LDI雷射直接暴光

A.手动曝光机是将将欲曝光板子上下底片以手动定PIN（引线末端的一段，通过软钎焊使这一段与印制板上的焊盘共同形成焊点）对位后送入机台面 吸真空后曝光

B.自动曝机一般含Loading/unloading，须于板子外框先做好工具孔，做初步定位。再由机台上之CCDCheck底片与孔的对位状况并做微调后入曝光区。

C、非平行光与平行光的差异：平行光可降低Under-Cut 其差异点可见图8.5显影后的比较做细线路(4mil以下)非得用平行光之曝光机

D、LDI(Laser Direct Imaging)激光直接感光之设备与感光方式是利用特殊之感光膜coating在板面。不须底片直接利用激光扫描曝光其细线可做 到2mil以内利用多beam方式18in³24in的板子已有号称曝光时间仅30秒。

4、显影

显像是把尚未发生聚合反应的区域用显像液（碳酸钠）将之冲洗掉已感光部份则因已发生聚合反应而洗不掉仍留在铜面上成为蚀刻或电镀之阻剂膜注意在 显像前不可忘记把表面玻璃纸撕掉。

5、二次铜（负片制作）：（1）脱脂（2）水洗（3）微蚀（4）水洗（5）酸浸（6）镀铜（7）水洗

（8）镀锡

镀液成分及作用：

硫酸铜：是供给槽液铜离子的主源。配槽时要用化学级之含水硫酸铜结晶溶解使用。平时作业中，则由阳极磷铜块解离补充。配液后要做活性炭处理(Carbon treatment)及假镀(是指对于重金属污染物，可用较大面积的电解镍板，经活化洗净后，进入镀液中进行电解，以此去除重金属离子。这种方法叫做“假镀”（dummy）)

硫酸：要使用试药级的纯酸硫酸有导电及溶解阳极的功用。日常操作中铜量因 吹气的氧化作用使阳极膜的溶解增加故液中的铜量会渐增而酸量会渐减。要逐日作分析，以维持其酸与铜之重量比在10:1以上，以维持良好的分布力。镀液在不镀时要关掉吹气以防铜量上升酸量下降及光泽之过度消耗。

氯离子：有助阳极的溶解及光泽剂的发挥功能。使阳极溶解均匀，镀层平滑光泽。氯离子正常时阳极膜呈黑色，过量时则变成灰白色，配液及添加用的水一 定要纯，不可用自来水。因其加有氯气或漂白粉含次氯酸盐会带入大量的氯离子

阳极：须使用含磷0.02-0.06的铜块其面积最好为阴极的两倍

添加剂：主要有活性剂（聚乙二醇）、光泽（乙撑硫脲,二硫苯骈咪唑,四氢噻唑硫酮）、整平（）、载体、润湿（消除氢气泡吸附在镀层表面所产生的针孔，主要种类包含乙基巳基硫酸钠、乙基巳基硫酸钠）等功能。

镀液的过滤循环：:一则使镀液流动，再则使浮游物被滤掉。其过滤速度应每小时至少使镀槽全部镀液能循环3次。当然速度愈大愈能降低扩散层的厚度，有利电镀。滤心要在5微吋以下之密度以达清洁之目的。

6、镀锡：

二次铜后镀锡铅合金的目的：

a.蚀刻阻剂, 保护其所覆盖的铜导体不会在碱性蚀铜时受到攻击 b.装配焊接, 须再经IR重熔,目前多已不使用.由于铅对人体有颇大的为害,废液处理不便宜因此纯锡电镀已渐取代传统锡铅 镀锡液组成：硫酸亚锡，硫酸和添加剂（蛋白质(Peptone)白明胶(Gelatin)-Naphthol 邻苯二酚(Hydroquinone)）组成，硫酸亚锡含量控制在35克/升左右，硫酸控制在10%左右。

镀锡前需要进行水洗和酸洗，以消除Cu2+等离子污染影响。

7、蚀刻：

A.剥膜:将抗电镀用途的干膜以药水剥除 B.线路蚀刻:把非导体部分的铜溶蚀掉

碱性环境下，蚀刻液成分见内层铜蚀刻工序。

在碱性环境溶液中铜离子非常容易形成氢氧化铜之沉淀，需加入足够的氨水，使产生氨铜缝合离子团。则可抑制其沉淀的发生。同时使原有多量的铜及继续溶解的铜在液中形成非常安定的氨铜络合离子。此种二价的 氨铜络合离子又可当成氧化剂使零价的金属铜被氧化而溶解。不过氧化还 原反应过程中会有一价亚铜离子)出现即：一反应之中间态亚铜离子之溶解度很差必须辅助以，氨水氨离子及空气中大量的氧使其继续氧化成为可溶的二价铜离子而又再成为蚀铜的氧化剂周而复始的继续蚀铜直到铜量太多而减慢为止故一般蚀刻机之抽风除了排除氨臭外更可供给新鲜的空气以加速蚀铜

8、剥锡(铅):最后将抗蚀刻的锡(铅)镀层除去 上述步骤是由水平联机设备一次完工

剥锡液成分：溶液组成有氟系/H2O2,HNO3/H2O2等配方。

1、首先将需要处理的工件放入退锡水中，工件要错开放置,不要重叠,25℃—40℃条件下退除锡镀层，以退尽为止。

2、当锡镀层退除后，在铜基体上会有一层灰黑色的膜，视客户要求而定，如需要去除此膜则必须用我司配送的除膜剂再清洗一次。

3、将退尽锡层的工件从退锡水中取出后，用自来水冲洗干净，然后投入到除膜剂中把铜基体表面上的膜去掉，大约浸泡20秒钟至1分钟。最后取出工件用洁净自来水冲洗干净即可。

4、在退锡过程中要轻缓对工件进行搅拌,但要注意:不要使工件与工件之间因碰撞而损害了精密零件.最好是将工件装在固定的塑料框中,工件与工件之间有一定距离,退镀过程只要晃动框,而不需要碰到工件.同时也避免了工件之间的重叠.9、防焊：

主要工艺流程如下：

印墨包含印刷型和帘涂型、静电喷涂型。

预烤：赶走油墨内的溶剂,使油墨部分硬化,不致在进行曝光时黏底片 后烤： A.通常在显像后墨硬度不足,会先进行UV硬化,增加其硬度以免做检修时刮伤.B.后烤的目的主要让油墨之环氧树脂彻底硬化,文字印刷条件一般为150°C,30min

10、文字印刷

11、表面焊垫的各种处理（1）金手指及喷锡 A金手指：

a.贴胶,割胶：目的是让板子仅露出欲镀金手指之部份线路,其它则以胶带贴住防镀.b、镀镍（垂直）：在此是作为金层与铜层之间的屏障防止铜扩散。镍液则是镍含量甚高而镀层应力极低的氨基磺酸镍(Ni(NH2SO3)2)或者硫酸镍，还有辅助剂（硼酸（缓冲作用，维持pH平衡，浓度35~55g/l）、氯化镍（保证阳极正常溶解，防止阳极钝化）、光亮剂（ACR-3010，浓度25~35ml/l）、防针孔剂（赶走氢气泡，阴离子表面活性剂：十二烷基硫酸钠、二乙基已基硫酸钠））

c、镀金：以弱酸性柠檬酸系列的微氰镀液为宜。B、喷锡（又称热风平整）喷锡又称热风整平，是将印制板浸入熔融的焊料中，再通过热风将印制板的表面及金属化孔内的多余焊料吹掉，从而得一个平滑，均匀光亮的焊料涂覆层。

分为垂直式和水平式。流程：

烤板——前处理——助焊剂涂覆—— 浸入熔融焊料——热风整平—— 后处理。

前处理包含：脱脂——清洗——微蚀——水洗酸洗(中和)——水洗热风干

（2）OSP（有机保焊膜,又称护铜剂,）

洁净的裸铜表面上，以化学的方法长出一层有机皮膜。这层膜具有防氧化，耐热冲击，耐湿性，用以保护铜表面于常态环境中不再继续生锈（氧化或硫化等）；但在后续的焊接高温中，此种保护膜又必须很容易被助焊剂所迅速清除，如此方可使露出的干净铜表面得以在极短的时间内与熔融焊锡立即结合成为牢固的焊点。

除油所使用药液成分：(1)柠檬酸(2)润湿剂(非离子界面活性剂)微蚀所用药液同内层微蚀工序（(1)过硫酸钠、(2)硫酸），使铜表面微粗化，与OSP膜之间有更好的附着性。

预浸：主成份为异丙醇及添加剂，作用:使銅面外層上一層保護膜,以避免銅離子帶入OSP槽內.OSP：主成份(1)主成分:苯基三連唑和(2)甲酸；作用使铜面外层覆盖一层有机保焊膜,防止铜面氧化.（3）化学镍金

A、化学镀镍 镀液: B.一般常用的镍盐为氯化镍(Nickel Chloride)C.一般常用的还原剂有次磷酸盐类(Hypophosphite)/甲醛(Formaldehyde)/联氨(Hydrazine)/硼氩化合物(Borohydride)/硼氢化合物(Amine Borane)D.螯合剂以柠檬酸盐(Citrate)最常见

E.槽液酸碱度需调整控制传统使用氨水(Amonia)也有配方使用三乙醇氨(Triethanol Amine)除可调整PH及比氨水在高温下稳定同时具有与柠檬酸钠结合共为镍金属螯合剂使镍可顺利有效地沉积于镀件上.B、镀金

分为“置换式镀金”与“无电金（化学镀）”。

“浸镀金”： 镀层薄且底面镀满即停止，Ni+2Au+→Ni2++2Au由于金和镍的标准电位相差较大，在合适的溶液中会发生金在镍表面置换沉积出来从反应式我们可以看出，浸金反应要进行必须要有镍层的存在，但随着置换出的金层厚度的增加，镍被完全覆盖后，浸金后反应就停止了。

常用化学浸金的配方与工艺条件：

氯化铵（150克/升）；柠檬酸氢二铵（100克/升）； 氰化亚金钾（2克/升）；稳定剂（适量）温度大于90℃； PH 4.0 化学镀金：原理是利用还原剂，将金还原后均匀沉积在被镀物上，达到所需要的厚度，金厚度可达15μ″以上。其反应式：Au++Red→Au0+ox 金（以氰化亚金钾形式加入）0.5-2克/升 柠檬酸铵 40-60克/升 氯化铵 70-80克/升 偏亚流酸钾（钠）10-15克/升 次亚磷酸钠 10-15克/升 PH 4.5-5.8 温度 90℃

化学镀镍层是极为均匀的，只要镀液能浸泡得到，溶质交换充分，镀层就会非常均匀，几乎可以达到仿形的效果。电镀无法对一些形状复杂的工件进行全表面施镀，但化学镀过以对任何形状工件施镀。

4、化学沉锡(垂直生产线)

酸性除油剂：甲烷磺酸＜10~25% ；丁氧基乙醇＜2.5~10%；水：剩余部份 微蚀液：硫酸氢钠＜10~25%，过硫酸钠＜50~100%

浸锡基本剂：LP

浸锡基本剂：2000 外观：无色

外观：无色 状态：液体

状态：液体 比重：1.33g/l

比重：1.12g/l 溶解性:完全溶于水

溶解性:完全溶于水 气味:有较强的刺激性

气味:有刺激性气味 主要成份:

主要成份: 甲基磺酸＜10~25% 硫脲＜10~25% 水：剩余部份

水：剩余部份 锡溶液：SF-C

浸锡添加剂 • 外观：浅黄色

外观：无色 • 状态：液体

状态：液体 • 比重：1.50g/l

比重：1.02g/l • 溶解性:完全溶于水

溶解性:完全溶于水 • 气味:有较强的刺激性

气味:有刺激性气味 • 主要成份:

主要成份: • 甲基磺酸锡＜25~50%

甲基磺酸＜2.5~5% • 水：剩余部份

水：剩余部份

5、沉银

2Ag+ + Cu0  2Ag0 + Cu++

主要工艺流程及药液

 酸性清洁(175084, 100ml/L, 43oC, 45s) 水洗

 微蚀(175085, 120g/l,175086,10g/l,2%的硫酸，2g/l的硫酸铜，37oC, 1min) 水洗

 预浸(0.1-0.2N的硝酸, 175098，0.01-0.02M，38oC, 30s) 银槽(0.12-0.22N的硝酸, 175098，0.02-0.04M，175097，0.6-0.9g/l, 52oC,60s)热纯水洗

 抗氧化(XD-7437-T, 175503，30%,49-54oC, 1min)水洗

 吹烘干

四、后序工序

成型、清洗、检验。

清洗：上板、高压冲洗——轻刷——水洗——吹干——烘干——冷却